A novel compact Ultra-Wideband bandpass filter

Shilong Qian, Jiasheng Hong, Alexander Rusakov, Irina B. Vendik

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

This paper presents a novel approach which can be used to design compact Ultra-Wideband (UWB) filters with high selectivity and excellent stopband performance. The design is based on a new 4-pole wideband filter circuit that provides transmission zeros to enhance the selectivity. In addition, the proposed design can be easily implemented on multilayer substrates with simple and low-cost manufacturing process. To demonstrate this, the filter has been fabricated on multilayer LCP substrates and has a compact size of 5.6mm × 5.6mm × 0.4mm (0.2 λg × 0.2 λg × 0.014 λg), where λg is the guided wavelength at 6.85GHz. This size is quite small as compared to other designs in open literature with similar performance. The measured frequency responses of all fabricated samples of this design are in very good agreement with simulation. This indicates that the design is a good candidate for practical UWB applications and very suitable for mass production with high yield. © 2013 European Microwave Association.

Original languageEnglish
Title of host publicationEuropean Microwave Week 2013, EuMW 2013 - Conference Proceedings; EuMC 2013: 43rd European Microwave Conference
PublisherIEEE
Pages896-899
Number of pages4
ISBN (Print)9782874870316
Publication statusPublished - 1 Dec 2013
Event43rd European Microwave Conference 2013 - Nuremberg, Germany
Duration: 6 Oct 201310 Oct 2013

Conference

Conference43rd European Microwave Conference 2013
Abbreviated titleEuMC 2013
CountryGermany
CityNuremberg
Period6/10/1310/10/13

Keywords

  • Bandpass Filter
  • LCP
  • Miniature Filter
  • SoP
  • UWB

Cite this

Qian, S., Hong, J., Rusakov, A., & Vendik, I. B. (2013). A novel compact Ultra-Wideband bandpass filter. In European Microwave Week 2013, EuMW 2013 - Conference Proceedings; EuMC 2013: 43rd European Microwave Conference (pp. 896-899). [06686802] IEEE.