A novel assembly method for chip/wafer bumping and MEMS integration

Changhai Wang, A J Pang, J Zhang, Alan John Sangster

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Original language	English
Title of host publication	MicroNano Integration, ed H Knobloch & Y Kaminorz, Springer
Pages	263-264
Number of pages	2
Publication status	Published - Dec 2003

Cite this

@inbook{07b052a0139c4c00a61c761cd9917a6e,

title = "A novel assembly method for chip/wafer bumping and MEMS integration",

author = "Changhai Wang and Pang, {A J} and J Zhang and Sangster, {Alan John}",

year = "2003",

month = dec,

language = "English",

isbn = "3540202528",

pages = "263--264",

booktitle = "MicroNano Integration, ed H Knobloch & Y Kaminorz, Springer",

}