A new grinding force model for micro grinding RB-SiC ceramic with grinding wheel topography as an input

Zhipeng Li, Feihu Zhang*, Xichun Luo, Xiaoguang Guo, Yukui Cai, Wenlong Chang, Jining Sun

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

21 Citations (Scopus)
49 Downloads (Pure)


The ability to predict the grinding force for hard and brittle materials is important to optimize and control the grinding process. However, it is a difficult task to establish a comprehensive grinding force model that takes into account the brittle fracture, grinding conditions, and random distribution of the grinding wheel topography. Therefore, this study developed a new grinding force model for micro-grinding of reaction-bonded silicon carbide (RB-SiC) ceramics. First, the grinding force components and grinding trajectory were analysed based on the critical depth of rubbing, ploughing, and brittle fracture. Afterwards, the corresponding individual grain force were established and the total grinding force was derived through incorporating the single grain force with dynamic cutting grains. Finally, a series of calibration and validation experiments were conducted to obtain the empirical coefficient and verify the accuracy of the model. It was found that ploughing and fracture were the dominate removal modes, which illustrate that the force components decomposed are correct. Furthermore, the values predicted according to the proposed model are consistent with the experimental data, with the average deviation of 6.793% and 8.926% for the normal and tangential force, respectively. This suggests that the proposed model is acceptable and can be used to simulate the grinding force for RB-SiC ceramics in practice.

Original languageEnglish
Article number368
Issue number8
Publication statusPublished - 26 Jul 2018


  • Brittle fracture
  • Grinding force model
  • Plastic
  • Protrusion height
  • Rubbing

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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