A low cost bumping method for flip chip assembly and MEMS integration

Jianhua Zhang, Changhai Wang, Jun Zeng, Ah J. Pang

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

In this paper, we present the development of a low cost chip/wafer bumping technique for flip chip assembly and microelectromechanical systems integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel, and gold bumps are fabricated on a low cost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallized with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Thermal cycling and bump shear test showed that reliable bonding was obtained between the bumps and the pads. Surface study using laser ionization mass analysis found no traces of of the polymer carrier on the surface of the bumps on the test chip after the completion of the bump transfer process. © 2007 IEEE.

Original languageEnglish
Pages (from-to)781-786
Number of pages6
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number4
DOIs
Publication statusPublished - Dec 2007

Keywords

  • Bumping
  • Flexible carrier
  • Flip chip
  • Microelectromechanical systems (MEMS)

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