A low cost bumping method for flip chip assembly and MEMS integration

J. H. Zhang, C. H. Wang, A. J. Pang, J. Zeng

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

In this paper we present the development of a low cost chip/wafer bumping technique for flip chip assembly and MEMS integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel and gold bumps are fabricated on a low cost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallised with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Bump shear test was conducted and showed that good bonding strength was achieved between the bumps and the pads. © 2004 IEEE.

Original languageEnglish
Title of host publicationProceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04
Pages171-176
Number of pages6
Publication statusPublished - 2004
EventProceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04 - Shanghai, China
Duration: 30 Jun 20043 Jul 2004

Conference

ConferenceProceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04
CountryChina
CityShanghai
Period30/06/043/07/04

Fingerprint Dive into the research topics of 'A low cost bumping method for flip chip assembly and MEMS integration'. Together they form a unique fingerprint.

  • Cite this

    Zhang, J. H., Wang, C. H., Pang, A. J., & Zeng, J. (2004). A low cost bumping method for flip chip assembly and MEMS integration. In Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04 (pp. 171-176)