A laser-assisted bonding method using a liquid crystal polymer film for MEMS and sensor packaging

Xin Jiang, Changhai Wang, Wei Liu

Research output: Contribution to journalArticle

3 Citations (Scopus)
376 Downloads (Pure)

Abstract

In this paper, we present the development of a
laser-based bonding method using a liquid crystal polymer
(LCP) film for cavity-based packaging of sensors
and Microelectromechanical systems (MEMS) devices. LCP
films possess the best properties among polymeric materials
in terms of moisture resistance and temperature stability.
We show that high-quality bonding of silicon and glass substrates
as well as encapsulation of molded LCP packages can be obtained
using a laser-assisted bonding method. Shear and leak tests were
carried out to demonstrate good quality of the laser-bonded
microcavities and packages. In situ temperature monitoring
was obtained by embedding a small temperature sensor just
below the bonding interface of an LCP package. The average
shear strength ranges from 20.8 to 26.1 MPa depending on
the design configurations and bonding conditions. The results of
the color liquid-based, and gross and fine leak-based tests show
pin-hole-free bonding and good hermeticity. The results of the
temperature monitoring work show the potential of the laserbased
approach for low-cost packaging of temperature-sensitive
devices in molded LCP packages.
Original languageEnglish
Pages (from-to)583-591
Number of pages9
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume5
Issue number5
DOIs
Publication statusPublished - 5 May 2015

Keywords

  • Laser joining
  • liquid crystal polymer (LCP) film

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