A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process

Robert Kay; Marc Phillipe Yves Desmulliez; C Bailey; S Stoyanov; G Glinski; N Ekere; R Durairaj; M Hendriksen; B Smith; P Ongley; D Price; A Roberts; M Whitmore; J Gourlay

A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, S Stoyanov, G Glinski, N Ekere, R Durairaj, M Hendriksen, B Smith, P Ongley, D Price, A Roberts, M Whitmore, J Gourlay

School of Engineering & Physical Sciences

Research output: Contribution to conference › Paper

Original language	English
Pages	123-128
Number of pages	6
Publication status	Published - Oct 2003
Event	Proceedings of Micro Tec - Duration: 1 Oct 2003 → …

Conference

Conference	Proceedings of Micro Tec
Period	1/10/03 → …

Cite this

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title = "A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process",

author = "Robert Kay and Desmulliez, {Marc Phillipe Yves} and C Bailey and S Stoyanov and G Glinski and N Ekere and R Durairaj and M Hendriksen and B Smith and P Ongley and D Price and A Roberts and M Whitmore and J Gourlay",

year = "2003",

month = oct,

language = "English",

pages = "123--128",

note = "Proceedings of Micro Tec ; Conference date: 01-10-2003",

}

TY - CONF

T1 - A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process

AU - Kay, Robert

AU - Desmulliez, Marc Phillipe Yves

AU - Bailey, C

AU - Stoyanov, S

AU - Glinski, G

AU - Ekere, N

AU - Durairaj, R

AU - Hendriksen, M

AU - Smith, B

AU - Ongley, P

AU - Price, D

AU - Roberts, A

AU - Whitmore, M

AU - Gourlay, J

PY - 2003/10

Y1 - 2003/10

M3 - Paper

SP - 123

EP - 128

T2 - Proceedings of Micro Tec

Y2 - 1 October 2003

ER -