A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, S Stoyanov, G Glinski, N Ekere, R Durairaj, M Hendriksen, B Smith, P Ongley, D Price, A Roberts, M Whitmore, J Gourlay

Research output: Contribution to conferencePaper

Original languageEnglish
Pages123-128
Number of pages6
Publication statusPublished - Oct 2003
EventProceedings of Micro Tec -
Duration: 1 Oct 2003 → …

Conference

ConferenceProceedings of Micro Tec
Period1/10/03 → …

Cite this

Kay, R., Desmulliez, M. P. Y., Bailey, C., Stoyanov, S., Glinski, G., Ekere, N., Durairaj, R., Hendriksen, M., Smith, B., Ongley, P., Price, D., Roberts, A., Whitmore, M., & Gourlay, J. (2003). A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process. 123-128. Paper presented at Proceedings of Micro Tec, .