A high volume, low cost and low temperature MEMS packaging technology based on a flip-chip assembly process

Robert Kay, Marc Phillipe Yves Desmulliez, C Bailey, S Stoyanov, G Glinski, N Ekere, R Durairaj, M Hendriksen, B Smith, P Ongley, D Price, A Roberts, M Whitmore, J Gourlay

Research output: Contribution to conferencePaper

Original languageEnglish
Number of pages6
Publication statusPublished - Oct 2003
EventProceedings of Micro Tec -
Duration: 1 Oct 2003 → …


ConferenceProceedings of Micro Tec
Period1/10/03 → …

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