A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor

Guandong Liu; Changhai Wang; Kexin Wang; Zhili Jia; Ruiqi Luo; Wei Ma

doi:10.1109/MEMS49605.2023.10052173

A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor

Guandong Liu, Changhai Wang, Kexin Wang, Zhili Jia, Ruiqi Luo, Wei Ma

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

This paper presents monolithic integration of an accelerometer and a force sensor based on a rapid 3D printing fabrication approach. With a triple-extruder 3D printer, for the first time, an insulating material, a conductive material, and a sacrificial material were printed alternately to fabricate a multifunctional MEMS device in a one-step printing process within an hour and without any additional metallization and assembly processes. Moreover, with the advantage of 3D printing in building geometrically complex structures, the accelerometer and the force sensor were easily integrated in vertical stacking using vertical feedthroughs in a TSV (Through-Silicon Via)-like design so that the multifunctional device could be directly mounted on a PCB substrate as a chip scale package. The performances of the multifunctional device indicate that the 3D printed sensors can be used in real-time motion and force monitoring for personalized customization and the monolithic integration method has potential applications in producing various integrated MEMS sensors.

Original language	English
Title of host publication	36th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Publisher	IEEE
Pages	598-601
Number of pages	4
ISBN (Electronic)	9781665493086
DOIs	https://doi.org/10.1109/MEMS49605.2023.10052173
Publication status	Published - 1 Mar 2023
Event	36th IEEE International Conference on Micro Electro Mechanical Systems 2023 - Munich, Germany Duration: 15 Jan 2023 → 19 Jan 2023

Conference

Conference	36th IEEE International Conference on Micro Electro Mechanical Systems 2023
Abbreviated title	MEMS 2023
Country/Territory	Germany
City	Munich
Period	15/01/23 → 19/01/23

Keywords

Integrated 3D printing
MEMS
accelerometer
force sensor
monolithic integration

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMS49605.2023.10052173

Cite this

@inproceedings{2b8c6eee9f854b2e9a611f3e6bb9538b,

title = "A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor",

abstract = "This paper presents monolithic integration of an accelerometer and a force sensor based on a rapid 3D printing fabrication approach. With a triple-extruder 3D printer, for the first time, an insulating material, a conductive material, and a sacrificial material were printed alternately to fabricate a multifunctional MEMS device in a one-step printing process within an hour and without any additional metallization and assembly processes. Moreover, with the advantage of 3D printing in building geometrically complex structures, the accelerometer and the force sensor were easily integrated in vertical stacking using vertical feedthroughs in a TSV (Through-Silicon Via)-like design so that the multifunctional device could be directly mounted on a PCB substrate as a chip scale package. The performances of the multifunctional device indicate that the 3D printed sensors can be used in real-time motion and force monitoring for personalized customization and the monolithic integration method has potential applications in producing various integrated MEMS sensors.",

keywords = "Integrated 3D printing, MEMS, accelerometer, force sensor, monolithic integration",

author = "Guandong Liu and Changhai Wang and Kexin Wang and Zhili Jia and Ruiqi Luo and Wei Ma",

note = "Funding Information: This work was partly supported by the UK Engineering and Physical Sciences Research Council (Grant EP/R024502/1) and Research Project of Zhejiang Lab (No.2022QA0AL02). The authors would like to thank Mr Mark Leonard, and Dr Alissa Potekhina at Heriot-Watt University for useful discussions. Publisher Copyright: {\textcopyright} 2023 IEEE.; 36th IEEE International Conference on Micro Electro Mechanical Systems 2023, MEMS 2023 ; Conference date: 15-01-2023 Through 19-01-2023",

year = "2023",

month = mar,

day = "1",

doi = "10.1109/MEMS49605.2023.10052173",

language = "English",

pages = "598--601",

booktitle = "36th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)",

publisher = "IEEE",

address = "United States",

}

Liu, G, Wang, C , Wang, K, Jia, Z, Luo, R & Ma, W 2023, A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor. in 36th IEEE International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, pp. 598-601, 36th IEEE International Conference on Micro Electro Mechanical Systems 2023, Munich, Bavaria, Germany, 15/01/23. https://doi.org/10.1109/MEMS49605.2023.10052173

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AU - Liu, Guandong

AU - Wang, Changhai

AU - Wang, Kexin

AU - Jia, Zhili

AU - Luo, Ruiqi

AU - Ma, Wei

N1 - Funding Information: This work was partly supported by the UK Engineering and Physical Sciences Research Council (Grant EP/R024502/1) and Research Project of Zhejiang Lab (No.2022QA0AL02). The authors would like to thank Mr Mark Leonard, and Dr Alissa Potekhina at Heriot-Watt University for useful discussions. Publisher Copyright: © 2023 IEEE.

PY - 2023/3/1

Y1 - 2023/3/1

N2 - This paper presents monolithic integration of an accelerometer and a force sensor based on a rapid 3D printing fabrication approach. With a triple-extruder 3D printer, for the first time, an insulating material, a conductive material, and a sacrificial material were printed alternately to fabricate a multifunctional MEMS device in a one-step printing process within an hour and without any additional metallization and assembly processes. Moreover, with the advantage of 3D printing in building geometrically complex structures, the accelerometer and the force sensor were easily integrated in vertical stacking using vertical feedthroughs in a TSV (Through-Silicon Via)-like design so that the multifunctional device could be directly mounted on a PCB substrate as a chip scale package. The performances of the multifunctional device indicate that the 3D printed sensors can be used in real-time motion and force monitoring for personalized customization and the monolithic integration method has potential applications in producing various integrated MEMS sensors.

AB - This paper presents monolithic integration of an accelerometer and a force sensor based on a rapid 3D printing fabrication approach. With a triple-extruder 3D printer, for the first time, an insulating material, a conductive material, and a sacrificial material were printed alternately to fabricate a multifunctional MEMS device in a one-step printing process within an hour and without any additional metallization and assembly processes. Moreover, with the advantage of 3D printing in building geometrically complex structures, the accelerometer and the force sensor were easily integrated in vertical stacking using vertical feedthroughs in a TSV (Through-Silicon Via)-like design so that the multifunctional device could be directly mounted on a PCB substrate as a chip scale package. The performances of the multifunctional device indicate that the 3D printed sensors can be used in real-time motion and force monitoring for personalized customization and the monolithic integration method has potential applications in producing various integrated MEMS sensors.

KW - Integrated 3D printing

KW - MEMS

KW - accelerometer

KW - force sensor

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DO - 10.1109/MEMS49605.2023.10052173

M3 - Conference contribution

SP - 598

EP - 601

BT - 36th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

PB - IEEE

T2 - 36th IEEE International Conference on Micro Electro Mechanical Systems 2023

Y2 - 15 January 2023 through 19 January 2023

ER -

A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor

Abstract

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Keywords

ASJC Scopus subject areas

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