A direct-writing approach to the micro-patterning of copper onto polyimide

INIS

• values 100%
• design 100%
• copper 100%
• processing 100%
• manufacturing 100%
• applications 50%
• comparative evaluations 50%
• surfaces 50%
• environment 50%
• cost 50%
• performance 50%
• metals 50%
• formaldehyde 50%
• plating 50%
• surveys 50%
• tracks 50%
• atmospheric pressure 50%

Engineering

• Direct-Writing 100%
• Manufacturing Process 50%
• Industrial Applications 50%
• Design of Experiments 50%
• Side Wall 50%
• Manufacturing Technique 50%
• Electroless Plating 50%
• Ambient Environment 50%
• Atmospheric Pressure 50%

Material Science

• Polyimide 100%
• Electroless Deposition 25%
• Experimental Design 25%