Abstract
A novel method to manufacture and assemble a microinductor that is based on flipchip bonding is described in this paper. The fabricated inductors have an inductance ranging from 0.3 ?H to 180 ?H. An optimum Q-factor of 14 was attained at 1MHz. Cobalt-Copper-iron cores maintained a constant inductance across a 1 kHz-1MHz bandwidth. The thin film laminate minimizes the eddy current loss and the hysteresis loss was negligible. Impedance increases linearly with frequency indicating that parasitic capacitance effects in this frequency range are negligible. The microinductor operated at an efficiency of 92% at 1MHz achieving a power density of 3.75 W/mm3. © 2006 IOP Publishing Ltd.
| Original language | English |
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| Pages (from-to) | 112-117 |
| Number of pages | 6 |
| Journal | Journal of Physics: Conference Series |
| Volume | 34 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 1 Apr 2006 |