A bump transfer method for flip chip assembly

J Zhang, Changhai Wang

Research output: Contribution to conferencePaper

1 Citation (Scopus)
Original languageEnglish
Pages321-323
Number of pages3
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

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