A bump transfer method for flip chip assembly

J Zhang, Changhai Wang

Research output: Contribution to conferencePaper

Original languageEnglish
Pages321-323
Number of pages3
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

Cite this

Zhang, J., & Wang, C. (2003). A bump transfer method for flip chip assembly. 321-323. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.
Zhang, J ; Wang, Changhai. / A bump transfer method for flip chip assembly. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.3 p.
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title = "A bump transfer method for flip chip assembly",
author = "J Zhang and Changhai Wang",
year = "2003",
month = "12",
language = "English",
pages = "321--323",
note = "5th Electronics Packaging Technology Conference, EPTC 2003 ; Conference date: 01-01-2003",

}

Zhang, J & Wang, C 2003, 'A bump transfer method for flip chip assembly' Paper presented at 5th Electronics Packaging Technology Conference, Singapore, 1/01/03, pp. 321-323.

A bump transfer method for flip chip assembly. / Zhang, J; Wang, Changhai.

2003. 321-323 Paper presented at 5th Electronics Packaging Technology Conference, Singapore.

Research output: Contribution to conferencePaper

TY - CONF

T1 - A bump transfer method for flip chip assembly

AU - Zhang, J

AU - Wang, Changhai

PY - 2003/12

Y1 - 2003/12

M3 - Paper

SP - 321

EP - 323

ER -

Zhang J, Wang C. A bump transfer method for flip chip assembly. 2003. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.