A bump transfer method for flip chip assembly

J Zhang, Changhai Wang

Research output: Contribution to conferencePaper

1 Citation (Scopus)
Original languageEnglish
Pages321-323
Number of pages3
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

Cite this

Zhang, J., & Wang, C. (2003). A bump transfer method for flip chip assembly. 321-323. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.