5.7 A 256×256 40nm/90nm CMOS 3D-Stacked 120dB Dynamic-Range Reconfigurable Time-Resolved SPAD Imager

Robert K. Henderson, Nick Johnston, Sam W. Hutchings, Istvan Gyongy, Tarek Al Abbas, Neale Dutton, Max Tyler, Susan Chan, Jonathan Leach

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Citations (Scopus)

Abstract

Light Detection and Ranging (LIDAR) applications pose extremely challenging dynamic range (DR) requirements on optical time-of-flight (ToF) receivers due to laser returns affected by the inverse square law over 2-3 decades of distance, diverse target reflectivity, and high solar background [1]. Integrated CMOS SPADs have a native DR exceeding 140dB, typically extending from the noise floor of few cps to 100's Mcps peak rate. To deliver this DR to downstream DSP, large SPAD time-resolved imaging arrays must count and time billions of single photon events per second demanding massively parallel on-chip pixel processing to achieve practical I/O power consumption and data rates. Hybrid Cu-Cu bonding offers a mass-manufacturable platform to implement these sensors by providing high-fill-factor SPADs optimised for NIR stacked on dense nanoscale digital processors [2]. Stacked sensor architectures involving pixel-level histogramming, on-chip peak detection and TDC/processor resource sharing are now being investigated [3-5].

Original languageEnglish
Title of host publication2019 IEEE International Solid-State Circuits Conference (ISSCC)
PublisherIEEE
Pages106-108
Number of pages3
ISBN (Electronic)9781538685310
DOIs
Publication statusPublished - 7 Mar 2019
Event2019 IEEE International Solid-State Circuits Conference - San Francisco, United States
Duration: 17 Feb 201921 Feb 2019

Publication series

NameInternational Solid- State Circuits Conference (ISSCC)
PublisherIEEE
ISSN (Electronic)2376-8606

Conference

Conference2019 IEEE International Solid-State Circuits Conference
Abbreviated titleISSCC 2019
CountryUnited States
CitySan Francisco
Period17/02/1921/02/19

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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