3D-mintegration: The design and manufacture of 3D miniaturised integrated products

M. P Y Desmulliez; D. Topham

doi:10.1109/ESTC.2008.4684442

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

M. P Y Desmulliez, D. Topham

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	737-741
Number of pages	5
DOIs	https://doi.org/10.1109/ESTC.2008.4684442
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference
Abbreviated title	ESTC
Country/Territory	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

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10.1109/ESTC.2008.4684442

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@inproceedings{988545f0f76249f7b75eb79fc31cfbbd,

title = "3D-mintegration: The design and manufacture of 3D miniaturised integrated products",

abstract = "Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques. {\textcopyright}2008 IEEE.",

author = "Desmulliez, {M. P Y} and D. Topham",

year = "2008",

doi = "10.1109/ESTC.2008.4684442",

language = "English",

isbn = "9781424428144",

pages = "737--741",

booktitle = "Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC",

note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

}

TY - GEN

T1 - 3D-mintegration

T2 - 2008 2nd Electronics Systemintegration Technology Conference

AU - Desmulliez, M. P Y

AU - Topham, D.

PY - 2008

Y1 - 2008

N2 - Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques. ©2008 IEEE.

AB - Integration on silicon is a mature procedure: well-tried compatible processes and well-characterised design methods routinely turn fantastic ideas into everyday commodities. But whole-product integration is another matter. This paper describes a UK-leading project to identify and develop revolutionary off-silicon manufacturing processes and to foster the insertion of these ground-breaking techniques into industry. Particular emphasis is placed upon the unexpected need for revisions of design philosophy to make the most of the new manufacturing techniques. ©2008 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=58149085907&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2008.4684442

DO - 10.1109/ESTC.2008.4684442

M3 - Conference contribution

SN - 9781424428144

SP - 737

EP - 741

BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

Y2 - 1 September 2008 through 4 September 2008

ER -

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

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Conference

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