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Research Output

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Conference contribution
2008

Porous alumina based capacitive MEMS RH sensor

Juhász, L., András, V. V., Veronika, T. H., Desmulliez, M. P. Y. & Dhariwal, R. S., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 381-385 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Selection of wavelet for de-noising PD waveforms for prognostics and diagnostics of aircraft wiring

Desai, C., Brown, K. E., Desmulliez, M. P. Y. & Sutherland, A., 2008, 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008. IEEE, p. 17-20 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Some applications of magnetic MEMS

Flynn, D. & Desmulliez, M., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 210-213 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

UV direct-writing of metals on polyimide

Ng, J. H. G., Desmulliez, M. P. Y., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 360-363 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

UV direct-writing of metals on polyimide substrates

Ng, J. H. G., Desmulliez, M. P. Y., Lamponi, M., Moffat, B. G., Walker, A. C., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 691-694 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2007

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 338-342 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An analysis of a microfabricated solenoid inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 1. p. 556-561 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A novel RF-curing technology for microelectronics and optoelectronics packaging

Sinclair, K. I., Desmulliez, M. P. Y. & Sangster, A. J., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 2. p. 1149-1157 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Evaluation of manufacturing techniques for a minifluidics demonstrator system

Kersaudy-Kerhoas, M., Kaufman, J. G., Attia, U. M., Marson, S., Allen, D., Douglas, A., O'Neill, W., Summersgill, P., Ryan, T. & Desmulliez, M., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Integration of IC technology with MEMS: silicon+ technology for the future

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M. P. Y., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A. & Gundlach, A. M., 2007, 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 11 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Microwave curing of materials for high density packaging

Goussetis, G., Sinclair, K. I., Sangster, A. J., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open ended microwave oven for flip-chip assembly

Sinclair, K. I., Sangster, A. J., Goussetis, G., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of the 37th European Microwave Conference, EUMC. p. 620-623 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

The implementation of cosserat theory into haptic sensing technology for large deflection beam model

Calis, M., Laghrouche, O. & Desmulliez, M. P. Y., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Variable frequency microwave curing of polymer materials in microelectronics packaging applications

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 791-796 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2006

Assessment of microinductors for DC-DC converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer modeling of a micro-manufactured one-turn inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 37-42 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping

Gorman, N. J., Kay, R. W., Roney, I. & Desmulliez, M. P. Y., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 323-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscaile magnetic components for DC-DC converter applications

Flynn, U. & Desmulliez, M. P. Y., 2006, Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators, ICEPT. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscale magnetic components for DC-DC converter applications

Flynn, D. & Desmulliez, M. P. Y., 2006, IET Seminar on MEMS Sensors and Actuators. 11367 ed. Vol. 2006. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sub-100 micron pitch stencil printing for wafer scale bumping

Desmulliez, M. P. Y., Kay, R. W., Abraham, E., De Gourcuff, E., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2006, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2005

Experimental study of a radial micro-channel cooling plate

Poppe, A., Horváth, G., Bognár, G., Kohári, Z., Desmulliez, M. P. Y. & Rencz, M., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 664-669 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Low-cost active-alignment of single-mode fiber-arrays

Weiland, D., Luetzelschwab, M., Desmulliez, M. P. Y., Missoffe, A. & Beck, C., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 199-203 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Manufacture of two-dimensional monomode optical fiber array using MEMS technology

Weiland, D., Missoffe, A. C. M., Luetzelschwab, M., Desmulliez, M. P. Y. & Beck, C., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 477-482 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Microscale magnetic components for the application of DC-DC converters operating in the 1-10 MHz range

Flynn, D., Toon, A. & Desmulliez, M., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 192-198 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys

Kay, R. W., De Gourcuff, E., Desmulliez, M. P. Y., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2005, Proceedings - Electronic Components and Technology Conference. Vol. 1. p. 848-854 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Thermal characterization of a radial micro-channel cooling plate

Bognár, G., Horváth, G., Kohári, Z., Pang, A. J., Desmulliez, M. P. Y., Poppe, A., Rencz, M. & Székely, V., 2005, Proceedings of the 21st IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium. p. 135-140 6 p. (IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)
2004

Design, manufacture and testing of a low-cost micro-channel cooling device

Pang, AJ., Desmulliez, MPY., Leonard, M., Dhariwal, RS., Reuben, RL., Holmes, AS., Hong, G., Pullen, KR., Waldron, F., Slattery, O., Rencz, M., Emerson, DR. & Barber, RW., 2004, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). IEEE, p. 564-568 5 p. (Electronics Packaging Technology Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Stencil printing at sub-100 microns pitch

Desmulliez, M. P. Y., Kay, R. W., Stoyanov, S. & Bailey, C., 2004, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. p. 354-358 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2003

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

Jackson, G. J., Hendriksen, M. W., Durairaj, R. K., Ekere, N. N., Desmulliez, M. P. Y. & Kay, R. W., 2003, Proceedings - Electronic Components and Technology Conference. p. 536-543 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)
1998

Free-space optoelectronic crossbar interconnect with terabit/s communication to silicon electronics

Fancey, S. J., Forbes, M. G., Taghizadeh, M. R., Dines, J. A. B., Buller, G. S., Walker, A. C., Desmulliez, M. P. Y., Pennelli, G., Marsh, J. H., Stanley, C. R., Horan, P., Byrne, D., Hegarty, J., Eitel, S. & Gulden, K. H., 1998, Proceedings of the 1998 International Symposium on Information Theory. p. 50-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1995

Construction of an optoelectronic bitonic sorter based on CMOS/InGaAs smart pixel technology

Walker, A. C., Desmulliez, M. P. Y., Tooley, F. A. P., Neilson, D. T., Dines, J. A. B., Baillie, D. A., Prince, S. M., Wilkinson, L. C., Taghizadeh, M. R., Blair, P., Snowdon, J. F., Wherrett, B. S., Stanley, C., Pottier, F. & Underwood, I., 1995, Proceedings of the 2nd International Conference on Massively Parallel Processing Using Optical Interconnections (MPPOI'95). p. 180-187 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1994

Optically interconnected exchange/bypass self-routing node arrays: logic and layout design

Desmulliez, M. P. Y., Tooley, F. A. P., Crowder, J. G., Grant, N. L., Wherrett, B. S., Novotny, R. A. & Foulk, P. W., 1994, Proceedings of the LEOS 1994 Summer Topical Meeting. p. 32-33 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution