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Research Output

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Conference contribution
2010

Numerical analysis of microwave underfill cure in ball-grid packages

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S. K., Morris, J. E., Desmulliez, M. P. Y. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Numerical analysis of polymer cure kinetics in isotropic conductive adhesives

Tilford, T., Morris, J. E., Ferenets, M., Rajaguru, P. R., Pavuluri, S., Desmulliez, M. P. Y. & Bailey, C., 2010, ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. p. 412-416 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications

Tilford, T., Morris, J. E., Ferenets, M., Rajaguru, P. R., Pavuluri, S. K., Desmulliez, M. P. Y. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

On the integration of microwave curing systems into microelectronics assembly processes

Adamietz, R., Müller, G., Othman, N., Eicher, F., Tilford, T., Ferenets, M., Pavuluri, S. K., Desmulliez, M. P. Y. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Optical fibre array manufacture using electrostatic actuation

Weiland, D., Luetzelschwab, M., Abraham, E., Desmulliez, M. P. Y., Molter, P., Giro, F. & Saumer, M., 2010, 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. p. 92-97 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Progress towards the development of novel fabrication and assembly methods for the next generation of ultrasonic transducers

Ng, J. H. G., Flynn, D., Lacrotte, Y., Desmulliez, M. P. Y., Ssekitoleko, R., Démoré, C. & Cochran, S., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Reliability improvement of a powder blasting process for micro-machining applications

Lacrotte, Y., Wilhelm, S. & Desmulliez, M. P. Y., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Silver nanocluster formation using UV radiation for direct metal patterning on polyimide

Watson, D., Ng, J. H. G., Sigworth, J., Bates, J. & Desmulliez, M. P. Y., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2009

Advances in laser based joining processes of micro-devices using localised heating

Lorenz, N., Smith, M. D., Millar, S., Desmulliez, M. & Hand, D. P., 2009, ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102. p. 999-1007 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: Modelling biofluids in a microchannel biochip separator

Xue, X., Patel, M. K., Kersaudy-Kerhoas, M., Bailey, C., Desmulliez, M. P. Y. & Topham, D., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 179-186 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fabrication and testing of microfluidic devices for blood cell separation

Kavanagh, D., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., Sep 2009, Brunel Institute for Bioengineering (BIB), The Brunel Collection. Brunel, UK: Brunel University

Research output: Chapter in Book/Report/Conference proceedingConference contribution

High density indium bumping using electrodeposition enhanced by megasonic agitation

Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 31-35 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Integrated sensors for health monitoring in advanced electronic systems

Wang, C. H., Liu, Y., Desmulliez, M. & Richardson, A., 2009, 2009 4th International Design and Test Workshop, IDT 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Investigation of the MeshFree RPIM solution for a haptic sensing approach to MEMS design

Munier, J. B., Laghrouche, O. & Desmulliez, M. P. Y., 2009, 2009 WRI World Congress on Computer Science and Information Engineering, CSIE 2009. Vol. 2. p. 97-101 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS three-axis accelerometer: Design, fabrication and application of measuring heart wall motion

Lowrie, C., Desmulliez, M. P. Y., Hoff, L., Elle, O. J. & Fosse, E., 2009, 2009 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, MEMS/MOEMS 2009. p. 229-234 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

Tilford, T., Pavuluri, S., Bailey, C. & Desmulliez, M. P. Y., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 927-931 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Parametrical modeling and design optimization of blood plasma separation device with microchannel mechanism

Xue, X., Patel, M. K., Kersaudy-Kerhoas, M., Bailey, C., Desmulliez, M. P. Y. & Kersaudy-Kerhoas, M., 2009, 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4. NEW YORK: IEEE, p. 1970-1976 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Polymer cure modeling for microelectronics applications

Morris, J. E., Tilford, T., Bailey, C., Sinclair, K. I. & Desmulliez, M. P. Y., 2009, ISSE 2009: 32nd International Spring Seminar on Electronics Technology: Hetero System Integration, the path to New Solutions in the Modern Electronics - Conference Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

11 Citations (Scopus)

Techniques for wirebond free interconnection of piezoelectric ultrasound arrays operating above 50 MHz

Bernassau, A. L., Flynn, D., Amalou, F., Desmulliez, M. P. Y. & Cochran, S., 2009, 2009 IEEE International Ultrasonics Symposium and Short Courses, IUS 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)
2008

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

Desmulliez, M. P. Y. & Topham, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 737-741 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2008, Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260. p. 129-138 10 p. (IFIP International Federation for Information Processing; vol. 260).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Advanced microwave oven for rapid curing of encapsulant

Sinclair, K. I., Tilford, T., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 551-556 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K. E., Desai, C., Flynn, D. & Sutherland, A., 2008, 2nd Electronics System-Integration Technology Conference, 2008. IEEE, p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K., Desai, C., Flynnl, D. & Sutherland, A., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Challenges in Modelling Biofluids in Microchannels

Xue, X., Patel, M. K., Bailey, C., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 287-292 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparison of encapsulant curing with convection and microwave systems

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008. (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design, Modeling and Characterization of a microinductor for future DC-DC power converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 577-582 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design and fabrication of a miniaturized three-axis accelerometer for measuring heart wall motion

Lowrie, C., Desmulliez, M., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 194-197 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design and fabrication of an implantable three-axis accelerometer for post-surgery monitoring of heart wall motion

Lowrie, C., Desmulliez, M. P. Y., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 435-440 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design methodology and manufacture of a microinductor

Flynn, D. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 364-369 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Embedded health monitoring strategies for aircraft wiring systems

Xu, Z., Saha, S., Koltsov, D., Richardson, A., Honary, B., Hannu, J., Sutherland, A., Moffat, B. G. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 463-469 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Haptic sensing for MEMS with application for cantilever and casimir effect

Calis, M. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 80-84 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Sinclair, K. L. & Desmulliez, M. P. Y., 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Rizvi, J., Yin, C., Sinclair, K. I. & Desmulliez, M. P. Y., 2008, Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Kaufmann, J., Desmulliez, M. P. Y., Price, D., Hughes, M., Strussevich, N. & Bailey, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1235-1239 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Integrated Biomedical Device for Blood Preparation

Kersaudy-Kerhoas, M., Kavanagh, D., Xue, X., Patel, M., Bailey, C., Dhariwal, R. S. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 447-452 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Megasonic enhanced electrodeposition

Kaufmann, J., Desmulliez, M. P. Y. & Price, D., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 370-372 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Megasonic enhanced wafer bumping process to enable high density electronics interconnection

Tian, Y., Kaufmann, J., Liu, C., Hutt, D. A., Stevens, B. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 725-729 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Micro-fabrication on 3-D surface by electrostatic induced lithography

Yu, W., Cargill, S., Leonard, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 111-116 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

MicroLens/UV-LED array packaging for dynamic and static alignment

Luetzelschwab, M., Desmulliez, M. P. Y. & Weiland, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1121-1126 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Microsystems technology for the separation of fetal cells from maternal blood

Kavanagh, D. M., Flynn, D., Amalou, F., Moffat, B. G., Dhariwal, R. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 785-789 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miniaturised optical encoder

Carr, J., Desmulliez, M. P. Y., Weston, N., McKendrick, D., Cunningham, G., McFarland, G., Meredith, W., McKee, A., Langton, C. & Eddie, I., 2008, Optical System Alignment and Tolerancing II. Vol. 7068.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Minimising the risk of defects in nano-imprint forming

Stoyanov, S., Amalou, F., Sinclair, K., Bailey, C. & Desmulliez, M., 2008, 2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008. p. 367-372 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modelling MEMS structures using cosserat theory

Calis, M., Lagrouche, O. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 77-79 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modelling the Nano-Imprint Forming process for the production of miniaturised 3D structures

Stoyanov, S., Amalou, F., Sinclair, K., Bailey, C. & Desmulliez, M. P. Y., 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Numerical analysis of thermal stresses induced during VFM encapsulant curing

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, 2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008. p. 348-353 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Open ended microwave oven for packaging

Sinclair, K. I., Tilford, T., Desmulliez, M. Y. P., Goussetis, G., Bailey, C., Parrott, K. & Sangster, A. J., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 16-20 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Optical encoder readhead chip

Carr, J., Desmulliez, M., Weston, N., McKendrick, D., Cunningham, G., McFarland, G., Meredith, W., McKee, A., Langton, C. & Eddie, I., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 797-801 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Polymer curing within an optimised open-ended microwave oven

Sinclair, K. I., Goussetis, G., Desmulliez, M. P. Y., Sangster, A. J., Tilford, T., Bailey, C. & Parrott, K., 2008, Proceedings of the 38th European Microwave Conference, EuMC 2008. p. 17-20 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution