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Research Output

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Conference contribution

15 MHz single element ultrasound needle transducers for neurosurgical applications

Jiang, Y., Meggs, C., Button, T., Schiavone, G., Desmulliez, M. P. Y., Qiu, Z., Mahboob, S., McPhillips, R., Démoré, C. E. M., Casey, G., Eljamel, S., Cochran, S. & Sanmartin, D. R., 2014, IEEE International Ultrasonics Symposium, IUS. IEEE, p. 687-690 4 p. 6932310

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

Desmulliez, M. P. Y. & Topham, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 737-741 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

A bio-inspired photopatterning method to deposit silver nanoparticles onto non conductive surfaces using spinach leaves extract in ethanol

Desmulliez, M. P. Y., Watson, D. E. G., Marques-Hueso, J. & Ng, J. H-G., 14 Jun 2016, Biomimetic and Biohybrid Systems: 5th International Conference, Living Machines 2016, Edinburgh, UK, July 19-22, 2016. Proceedings. Lepora, N. F., Mura, A., Mangan, M., Verschure, P. F. M. J., Desmulliez, M. & Prescott, T. J. (eds.). 8 p. (Lecture Notes in Artificial Intelligence; vol. 9793).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

A compact packaging technique for the integration of ultrasound probes in surgical needles

Schiavone, G., Desmulliez, M. P. Y., Jones, T., Price, D., McPhillips, R., Qiu, Z., Demore, C. E. M., Cochran, S., Mahboob, S. O., Jiang, Y., Meggs, C. & Button, T. W., 16 Jul 2015, Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on. IEEE, 7160970

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 338-342 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2008, Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260. p. 129-138 10 p. (IFIP International Federation for Information Processing; vol. 260).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

Schiavone, G., Jones, T., Price, D., McPhillips, R., Qiu, Z., Demore, C. E. M., Jiang, Y., Meggs, C., Mahboob, S. O., Eljamel, S., Button, T. W., Cochran, S. & Desmulliez, M. P. Y., 2014, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. IEEE, p. 88-93 6 p. 7028266

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Advanced microwave oven for rapid curing of encapsulant

Sinclair, K. I., Tilford, T., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 551-556 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Advances in laser based joining processes of micro-devices using localised heating

Lorenz, N., Smith, M. D., Millar, S., Desmulliez, M. & Hand, D. P., 2009, ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102. p. 999-1007 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Advances in the design and test of a novel open ended microwave oven

Pavuluri, S. K., Tilford, T., Goussetis, G., Desmulliez, M. P. Y., Ferenets, M., Adamietz, R., Eicher, F. & Bailey, C., 2010, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. p. 247-252 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Agile MEMS packaging for mass customized MEMS products

Kaufmann, J., Flynn, D., Brown, K. E. & Desmulliez, M. P. Y., 23 Jan 2012, 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, p. 41-45 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K. E., Desai, C., Flynn, D. & Sutherland, A., 2008, 2nd Electronics System-Integration Technology Conference, 2008. IEEE, p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K., Desai, C., Flynnl, D. & Sutherland, A., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

An additive method for photopatterning of metals on flexible substrates

Ng, J. H-G., Watson, D. E. G., Sigwarth, J., Mccarthy, A., Suyal, H., Hand, D. P., Hin, T. Y. & Desmulliez, M. P. Y., 2010, Proceedings of the 36th International MATADOR Conference. Hinduja, S. & Li, L. (eds.). Springer, p. 389-392 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

An analysis of a microfabricated solenoid inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 1. p. 556-561 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A novel RF-curing technology for microelectronics and optoelectronics packaging

Sinclair, K. I., Desmulliez, M. P. Y. & Sangster, A. J., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 2. p. 1149-1157 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Assessment of microinductors for DC-DC converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Assessment of the ultrasonic properties of additive manufactured materials for passive components of piezoelectric transducers

Farinas, M. D., Álvarez-Arenas, T. G., Cummins, G., Desmulliez, M. P. Y., Seetohul, V. & Cochran, S., 3 Nov 2016, 2016 IEEE International Ultrasonics Symposium (IUS). IEEE, 7728770. (IEEE International Ultrasonics Symposium : proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
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1 Citation (Scopus)
89 Downloads (Pure)

Automated sampling and/or detection systems for safe drinking water

Desmulliez, M. P. Y., 9 Nov 2016, 11th Conference Proceedings of the RME. p. 10 1 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bespoke interconnect technologies for optoelectronic and biomedical products

Desmulliez, M. P. Y. & Flynn, D., 2010, 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators

Xue, X., Marson, S., Patel, M. K., Attia, U. M., Bailey, C., O'Neill, W., Topham, D. & Desmulliez, M. P. Y., 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 1021-1030 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Challenges in Modelling Biofluids in Microchannels

Xue, X., Patel, M. K., Bailey, C., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 287-292 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Characterisation of adhesive bonds for ingestible biomedical applications

Cummins, G. & Desmulliez, M. P. Y., 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE, 7412391

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparison of encapsulant curing with convection and microwave systems

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008. (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Computational electrohydrodynamics in the fabrication of hollow polymer microstructures

Tonry, C., Patel, M., Desmulliez, M. P. Y., Yu, W. & Bailey, C., May 2015, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. IEEE, 7103153

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Computer-aided biomimetics

Kruiper, R., Chen-Burger, Y-H. & Desmulliez, M. P. Y., 2016, Biomimetic and Biohybrid Systems: 5th International Conference, Living Machines 2016, Edinburgh, UK, July 19-22, 2016. Proceedings. Lepora, N. F., Mura, A., Mangan, M., Verschure, P. F. M. J., Desmulliez, M. & Prescott, T. J. (eds.). Springer, Vol. 9793. p. 131-143 13 p. (Lecture Notes in Computer Science; vol. 9793).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
3 Citations (Scopus)
55 Downloads (Pure)

Computer modeling of a micro-manufactured one-turn inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 37-42 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Conformal meander shaped antenna for biotelemetry in endoscopic capsules

Faerber, J. & Desmulliez, M. P. Y., 2015, 2015 Loughborough Antennas & Propagation Conference (LAPC). IEEE, 4 p. 7366056

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Construction of an optoelectronic bitonic sorter based on CMOS/InGaAs smart pixel technology

Walker, A. C., Desmulliez, M. P. Y., Tooley, F. A. P., Neilson, D. T., Dines, J. A. B., Baillie, D. A., Prince, S. M., Wilkinson, L. C., Taghizadeh, M. R., Blair, P., Snowdon, J. F., Wherrett, B. S., Stanley, C., Pottier, F. & Underwood, I., 1995, Proceedings of the 2nd International Conference on Massively Parallel Processing Using Optical Interconnections (MPPOI'95). p. 180-187 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design, manufacture and testing of a low-cost micro-channel cooling device

Pang, AJ., Desmulliez, MPY., Leonard, M., Dhariwal, RS., Reuben, RL., Holmes, AS., Hong, G., Pullen, KR., Waldron, F., Slattery, O., Rencz, M., Emerson, DR. & Barber, RW., 2004, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). IEEE, p. 564-568 5 p. (Electronics Packaging Technology Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping

Gorman, N. J., Kay, R. W., Roney, I. & Desmulliez, M. P. Y., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 323-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design, Modeling and Characterization of a microinductor for future DC-DC power converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 577-582 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design and fabrication of a miniaturized three-axis accelerometer for measuring heart wall motion

Lowrie, C., Desmulliez, M., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 194-197 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design and fabrication of an implantable three-axis accelerometer for post-surgery monitoring of heart wall motion

Lowrie, C., Desmulliez, M. P. Y., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 435-440 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design methodology and manufacture of a microinductor

Flynn, D. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 364-369 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design of conformal wideband antennas for capsule endoscopy within a body tissue environment

Faerber, J., Cummins, G. & Desmulliez, M. P. Y., 4 Oct 2016, Proceedings of the 46th European Microwave Conference . p. 1223-1226 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

Jackson, G. J., Hendriksen, M. W., Durairaj, R. K., Ekere, N. N., Desmulliez, M. P. Y. & Kay, R. W., 2003, Proceedings - Electronic Components and Technology Conference. p. 536-543 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)

Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: Modelling biofluids in a microchannel biochip separator

Xue, X., Patel, M. K., Kersaudy-Kerhoas, M., Bailey, C., Desmulliez, M. P. Y. & Topham, D., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 179-186 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Effect of seed layers on the performance of planar spiral microinductors

Walker, R., Sirotkin, E., Terry, J. G., Smith, S., Desmulliez, M. P. Y. & Walton, A. J., 1 Jan 2014, IEEE International Conference on Microelectronic Test Structures. IEEE, p. 135-140 6 p. 6841481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuators

Schiavone, G., Ng, J. H., Record, P. M., Shang, X., Wlodarczyk, K. L., Hand, D. P., Cummins, G. & Desmulliez, M. P. Y., 2015, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. IEEE, p. 246-249 4 p. 7048373

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Costello, S., Strusevich, N., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., Price, D., Bennet, M., Jones, A. C. & Desmulliez, M. P. Y., 2012, DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Piscataway (New Jersey): IEEE, p. 98-102 5 p. 6235340

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Embedded health monitoring strategies for aircraft wiring systems

Xu, Z., Saha, S., Koltsov, D., Richardson, A., Honary, B., Hannu, J., Sutherland, A., Moffat, B. G. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 463-469 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Evaluation of manufacturing techniques for a minifluidics demonstrator system

Kersaudy-Kerhoas, M., Kaufman, J. G., Attia, U. M., Marson, S., Allen, D., Douglas, A., O'Neill, W., Summersgill, P., Ryan, T. & Desmulliez, M., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Experimental investigation of open-ended microwave oven assisted encapsulation process

Pavuluri, S. K., Ferenets, M., Goussetis, G., Desmulliez, M. P. Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Experimental study of a radial micro-channel cooling plate

Poppe, A., Horváth, G., Bognár, G., Kohári, Z., Desmulliez, M. P. Y. & Rencz, M., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 664-669 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Ex-vivo navigation of neurosurgical biopsy needles using microultrasound transducers with M-mode imaging

McPhillips, R., Qiu, Z., Jiang, Y., Mahboob, S. O., Wang, H., Meggs, C., Schiavone, G., Sanmartin, D. R., Eljamel, S., Desmulliez, M. P. Y., Button, T., Cochran, S. & Demore, C. E. M., 2015, 2015 IEEE International Ultrasonics Symposium Proceedings. IEEE, p. 1-4 4 p. (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Fabrication and testing of microfluidic devices for blood cell separation

Kavanagh, D., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., Sep 2009, Brunel Institute for Bioengineering (BIB), The Brunel Collection. Brunel, UK: Brunel University

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Free-space optoelectronic crossbar interconnect with terabit/s communication to silicon electronics

Fancey, S. J., Forbes, M. G., Taghizadeh, M. R., Dines, J. A. B., Buller, G. S., Walker, A. C., Desmulliez, M. P. Y., Pennelli, G., Marsh, J. H., Stanley, C. R., Horan, P., Byrne, D., Hegarty, J., Eitel, S. & Gulden, K. H., 1998, Proceedings of the 1998 International Symposium on Information Theory. p. 50-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Haptic sensing for MEMS with application for cantilever and casimir effect

Calis, M. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 80-84 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

High density indium bumping using electrodeposition enhanced by megasonic agitation

Tian, Y., Liu, C., Hutt, D., Stevens, B., Flynn, D. & Desmulliez, M. P. Y., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 31-35 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)