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Research Output

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Conference contribution
1994

Optically interconnected exchange/bypass self-routing node arrays: logic and layout design

Desmulliez, M. P. Y., Tooley, F. A. P., Crowder, J. G., Grant, N. L., Wherrett, B. S., Novotny, R. A. & Foulk, P. W., 1994, Proceedings of the LEOS 1994 Summer Topical Meeting. p. 32-33 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1995

Construction of an optoelectronic bitonic sorter based on CMOS/InGaAs smart pixel technology

Walker, A. C., Desmulliez, M. P. Y., Tooley, F. A. P., Neilson, D. T., Dines, J. A. B., Baillie, D. A., Prince, S. M., Wilkinson, L. C., Taghizadeh, M. R., Blair, P., Snowdon, J. F., Wherrett, B. S., Stanley, C., Pottier, F. & Underwood, I., 1995, Proceedings of the 2nd International Conference on Massively Parallel Processing Using Optical Interconnections (MPPOI'95). p. 180-187 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1998

Free-space optoelectronic crossbar interconnect with terabit/s communication to silicon electronics

Fancey, S. J., Forbes, M. G., Taghizadeh, M. R., Dines, J. A. B., Buller, G. S., Walker, A. C., Desmulliez, M. P. Y., Pennelli, G., Marsh, J. H., Stanley, C. R., Horan, P., Byrne, D., Hegarty, J., Eitel, S. & Gulden, K. H., 1998, Proceedings of the 1998 International Symposium on Information Theory. p. 50-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2003

Differences in the sub-processes of ultra fine pitch stencil printing due to type-6 and type-7 Pb-free solder pastes used for flip chip

Jackson, G. J., Hendriksen, M. W., Durairaj, R. K., Ekere, N. N., Desmulliez, M. P. Y. & Kay, R. W., 2003, Proceedings - Electronic Components and Technology Conference. p. 536-543 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

23 Citations (Scopus)
2004

Design, manufacture and testing of a low-cost micro-channel cooling device

Pang, AJ., Desmulliez, MPY., Leonard, M., Dhariwal, RS., Reuben, RL., Holmes, AS., Hong, G., Pullen, KR., Waldron, F., Slattery, O., Rencz, M., Emerson, DR. & Barber, RW., 2004, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. Toh, KC., Mui, YC., How, J. & Pang, JHL. (eds.). IEEE, p. 564-568 5 p. (Electronics Packaging Technology Conference Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Stencil printing at sub-100 microns pitch

Desmulliez, M. P. Y., Kay, R. W., Stoyanov, S. & Bailey, C., 2004, Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004. p. 354-358 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
2005

Experimental study of a radial micro-channel cooling plate

Poppe, A., Horváth, G., Bognár, G., Kohári, Z., Desmulliez, M. P. Y. & Rencz, M., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 664-669 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Low-cost active-alignment of single-mode fiber-arrays

Weiland, D., Luetzelschwab, M., Desmulliez, M. P. Y., Missoffe, A. & Beck, C., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 199-203 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Manufacture of two-dimensional monomode optical fiber array using MEMS technology

Weiland, D., Missoffe, A. C. M., Luetzelschwab, M., Desmulliez, M. P. Y. & Beck, C., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 477-482 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Microscale magnetic components for the application of DC-DC converters operating in the 1-10 MHz range

Flynn, D., Toon, A. & Desmulliez, M., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 192-198 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys

Kay, R. W., De Gourcuff, E., Desmulliez, M. P. Y., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2005, Proceedings - Electronic Components and Technology Conference. Vol. 1. p. 848-854 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Thermal characterization of a radial micro-channel cooling plate

Bognár, G., Horváth, G., Kohári, Z., Pang, A. J., Desmulliez, M. P. Y., Poppe, A., Rencz, M. & Székely, V., 2005, Proceedings of the 21st IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium. p. 135-140 6 p. (IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)
2006

Assessment of microinductors for DC-DC converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer modeling of a micro-manufactured one-turn inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 37-42 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping

Gorman, N. J., Kay, R. W., Roney, I. & Desmulliez, M. P. Y., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 323-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscaile magnetic components for DC-DC converter applications

Flynn, U. & Desmulliez, M. P. Y., 2006, Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators, ICEPT. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscale magnetic components for DC-DC converter applications

Flynn, D. & Desmulliez, M. P. Y., 2006, IET Seminar on MEMS Sensors and Actuators. 11367 ed. Vol. 2006. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sub-100 micron pitch stencil printing for wafer scale bumping

Desmulliez, M. P. Y., Kay, R. W., Abraham, E., De Gourcuff, E., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2006, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2007

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 338-342 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An analysis of a microfabricated solenoid inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 1. p. 556-561 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A novel RF-curing technology for microelectronics and optoelectronics packaging

Sinclair, K. I., Desmulliez, M. P. Y. & Sangster, A. J., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 2. p. 1149-1157 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

24 Citations (Scopus)

Evaluation of manufacturing techniques for a minifluidics demonstrator system

Kersaudy-Kerhoas, M., Kaufman, J. G., Attia, U. M., Marson, S., Allen, D., Douglas, A., O'Neill, W., Summersgill, P., Ryan, T. & Desmulliez, M., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Integration of IC technology with MEMS: silicon+ technology for the future

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M. P. Y., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A. & Gundlach, A. M., 2007, 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 11 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Microwave curing of materials for high density packaging

Goussetis, G., Sinclair, K. I., Sangster, A. J., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open ended microwave oven for flip-chip assembly

Sinclair, K. I., Sangster, A. J., Goussetis, G., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of the 37th European Microwave Conference, EUMC. p. 620-623 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

The implementation of cosserat theory into haptic sensing technology for large deflection beam model

Calis, M., Laghrouche, O. & Desmulliez, M. P. Y., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Variable frequency microwave curing of polymer materials in microelectronics packaging applications

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 791-796 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)
2008

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

Desmulliez, M. P. Y. & Topham, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 737-741 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2008, Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260. p. 129-138 10 p. (IFIP International Federation for Information Processing; vol. 260).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Advanced microwave oven for rapid curing of encapsulant

Sinclair, K. I., Tilford, T., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 551-556 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K. E., Desai, C., Flynn, D. & Sutherland, A., 2008, 2nd Electronics System-Integration Technology Conference, 2008. IEEE, p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K., Desai, C., Flynnl, D. & Sutherland, A., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Challenges in Modelling Biofluids in Microchannels

Xue, X., Patel, M. K., Bailey, C., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 287-292 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparison of encapsulant curing with convection and microwave systems

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008. (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design, Modeling and Characterization of a microinductor for future DC-DC power converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 577-582 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design and fabrication of a miniaturized three-axis accelerometer for measuring heart wall motion

Lowrie, C., Desmulliez, M., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 194-197 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design and fabrication of an implantable three-axis accelerometer for post-surgery monitoring of heart wall motion

Lowrie, C., Desmulliez, M. P. Y., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 435-440 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design methodology and manufacture of a microinductor

Flynn, D. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 364-369 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Embedded health monitoring strategies for aircraft wiring systems

Xu, Z., Saha, S., Koltsov, D., Richardson, A., Honary, B., Hannu, J., Sutherland, A., Moffat, B. G. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 463-469 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Haptic sensing for MEMS with application for cantilever and casimir effect

Calis, M. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 80-84 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Sinclair, K. L. & Desmulliez, M. P. Y., 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Rizvi, J., Yin, C., Sinclair, K. I. & Desmulliez, M. P. Y., 2008, Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Kaufmann, J., Desmulliez, M. P. Y., Price, D., Hughes, M., Strussevich, N. & Bailey, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1235-1239 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Integrated Biomedical Device for Blood Preparation

Kersaudy-Kerhoas, M., Kavanagh, D., Xue, X., Patel, M., Bailey, C., Dhariwal, R. S. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 447-452 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Megasonic enhanced electrodeposition

Kaufmann, J., Desmulliez, M. P. Y. & Price, D., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 370-372 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Megasonic enhanced wafer bumping process to enable high density electronics interconnection

Tian, Y., Kaufmann, J., Liu, C., Hutt, D. A., Stevens, B. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 725-729 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Micro-fabrication on 3-D surface by electrostatic induced lithography

Yu, W., Cargill, S., Leonard, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 111-116 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

MicroLens/UV-LED array packaging for dynamic and static alignment

Luetzelschwab, M., Desmulliez, M. P. Y. & Weiland, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1121-1126 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Microsystems technology for the separation of fetal cells from maternal blood

Kavanagh, D. M., Flynn, D., Amalou, F., Moffat, B. G., Dhariwal, R. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 785-789 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miniaturised optical encoder

Carr, J., Desmulliez, M. P. Y., Weston, N., McKendrick, D., Cunningham, G., McFarland, G., Meredith, W., McKee, A., Langton, C. & Eddie, I., 2008, Optical System Alignment and Tolerancing II. Vol. 7068.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)