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Research Output 1994 2019

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Conference contribution
2019

Implementation of a Wireless Power Transfer System for Prosthetic Hands

Khan, S. R. & Desmulliez, M. P. Y., 17 Oct 2019, 2019 IEEE-APS Topical Conference on Antennas and Propagation in Wireless Communications (APWC). IEEE, p. 59-62 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Prosthetics
coils
wrist
Tissue
power amplifiers

Integrated Front End Circuitry for Microultrasound Capsule Endoscopy

Lay, H. S., Lemke, C., Cox, B. F., Qiu, Y., Cummins, G., Ferrazzano, E., West, C., Desmulliez, M. P. Y., Eddie Clutton, R. & Cochran, S., 25 Feb 2019, 2018 IEEE International Ultrasonics Symposium (IUS). IEEE, 8579738. (IEEE International Ultrasonics Symposium (IUS)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
capsules
endoscopes
noise reduction
seats
signal to noise ratios

PEI/Ag as an Optical Gas Nano-Sensor for Intelligent Food Packaging

Rvspayeva, A., Jones, T. D. A., Hughes, P. A., Esfahani, M. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Desmulliez, M. P. Y. & Marques-Hueso, J., 28 Jan 2019, 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO). IEEE, 8626269. (IEEE International Conference on Nanotechnology (IEEE-NANO)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Polyetherimides
food
packaging
Packaging
chickens
2018

Hybrid Additive Manufacture of Conformal Antennas

Esfahani, M. R. N., Shuttleworth, M. P., Harris, R. A., Kay, R. W., Doychinov, V., Robertson, I. D., Marques-Hueso, J., Jones, T. D. A., Ryspayeva, A. & Desmulliez, M. P. Y., 10 Sep 2018, 2018 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP). IEEE, 8457128

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Permittivity
Antennas
Polyetherimides
Directional patterns (antenna)
Substrates

Joint international master in smart systems integration: University collaboration for improved education

Aasmundtveit, K. E., Wang, C., Rencz, M., Desmulliez, M. P. Y., Ender, F. & Imenes, K., 24 May 2018, 2018 IEEE Global Engineering Education Conference (EDUCON). IEEE, p. 624-629 6 p. (IEEE Global Engineering Education Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Education
Students
graduate
education
university

New analytical model for the characterisation of printed spiral coils for wireless power transfer

Khan, S. R., Pavuluri, S. K. & Desmulliez, M. P. Y., 2018, 12th European Conference on Antennas and Propagation (EuCAP 2018). Institution of Engineering and Technology, 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Analytical models
Defibrillators
Pacemakers
Inductance
MATLAB

Numerical simulation of particle motion in a phase modulated surface acoustic wave microfluidic device

Simon, G., Andrade, M. A. B., Riehle, M. O., Desmulliez, M. P. Y. & Bernassau, A. L., 20 Dec 2018, 2018 IEEE International Ultrasonics Symposium (IUS). IEEE, 8579942. (IEEE International Ultrasonics Symposium (IUS)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
microfluidic devices
particle motion
classifying
acoustic streaming
acoustics
2017

Optimization and characterisation of bonding of piezoelectric transducers using anisotropic conductive adhesive

Cummins, G., Gao, J., McPhillips, R., Watson, D., Cochran, S. & Desmulliez, M. P. Y., 2 Nov 2017, 2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 8092114. (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
piezoelectric transducers
adhesives
transducers
optimization
miniaturization

Reconfigurable particle separation by dynamic acoustic fields in microfluidic devices

Simon, G., Marques-Hueso, J., Desmulliez, M. P. Y., Bernassau, A. L., Roolvink, D., Burns, G., Cormack, P. A. G., Andrade, M. A. B., Reboud, J., Cooper, J. M. & Riehle, M. O., 2017, Proceedings of the 24th International Congress on Sound and Vibration. International Institute of Acoustics and Vibrations, p. 1-7 7 p. (Proceedings of the International Congress on Sound and Vibration).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
microfluidic devices
acoustics
cells
antinodes
stem cells

The fabrication and integration of a 15 MHz array within a biopsy needle

McPhillips, R., Watson, D., Gao, J., Desmulliez, M. P. Y., Vinnicombe, S., Cochran, S. & Demore, C., 2 Nov 2017, 2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 8091764. (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
needles
fabrication
lymphatic system
navigation
breast

Towards Identifying Biological Research Articles in Computer-Aided Biomimetics

Kruiper, R., Vincent, J., Chen-Burger, J. & Desmulliez, M. P. Y., 16 Jul 2017, Biomimetic and Biohybrid Systems. Mangan, M., Cutkosky, M., Mura, A., Verschure, P. F. M. J., Prescott, T. & Lepora, N. (eds.). Springer International Publishing, p. 242-254 13 p. (Lecture Notes in Artificial Intelligence; vol. 10384).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Biomimetics
Biological systems
Terminology
Decomposition
Engineers

Translational trial outcomes for capsule endoscopy test devices

Lay, H. S., Connor, C., Cummins, G., Seetohul, V., Cox, B. F., Turcanu, M., Qiu, Y., McPhillips, R., Desmulliez, M. P. Y., Clutton, E. & Cochran, S., 2 Nov 2017, 2017 IEEE International Ultrasonics Symposium (IUS). IEEE, 8091826. (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Capsule Endoscopy
Transducers
Capsules
Capsule Endoscopes
Mucous Membrane

Ultra-fast-prototyping of PMMA structures for micro-engineering applications: Choosing the right material

Ongaro, A. E., Conoscenti, G., Liga, A., Brucato, V., Desmulliez, M. P. Y., Howarth, N., La Carrubba, V. & Kersaudy-Kerhoas, M., 2017, Advances in Manufacturing Technology XXXI - Proceedings of the 15th International Conference on Manufacturing Research, ICMR 2017: Incorporating the 32nd National Conference on Manufacturing Research. Gao, J., El Souri, M. & Keates, S. (eds.). IOS Press, Vol. 6. p. 181-186 6 p. (Advances in Transdisciplinary Engineering).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Prototyping
Engineering Application
Polymethyl methacrylates
CO2 Laser
Rapid Prototyping
2016

A bio-inspired photopatterning method to deposit silver nanoparticles onto non conductive surfaces using spinach leaves extract in ethanol

Desmulliez, M. P. Y., Watson, D. E. G., Marques-Hueso, J. & Ng, J. H-G., 14 Jun 2016, Biomimetic and Biohybrid Systems: 5th International Conference, Living Machines 2016, Edinburgh, UK, July 19-22, 2016. Proceedings. Lepora, N. F., Mura, A., Mangan, M., Verschure, P. F. M. J., Desmulliez, M. & Prescott, T. J. (eds.). 8 p. (Lecture Notes in Artificial Intelligence; vol. 9793).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Assessment of the ultrasonic properties of additive manufactured materials for passive components of piezoelectric transducers

Farinas, M. D., Álvarez-Arenas, T. G., Cummins, G., Desmulliez, M. P. Y., Seetohul, V. & Cochran, S., 3 Nov 2016, 2016 IEEE International Ultrasonics Symposium (IUS). IEEE, 7728770. (IEEE International Ultrasonics Symposium : proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
piezoelectric transducers
manufacturing
ultrasonics
acoustic properties
backups

Automated sampling and/or detection systems for safe drinking water

Desmulliez, M. P. Y., 9 Nov 2016, 11th Conference Proceedings of the RME. p. 10 1 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Computer-aided biomimetics

Kruiper, R., Chen-Burger, Y-H. & Desmulliez, M. P. Y., 2016, Biomimetic and Biohybrid Systems: 5th International Conference, Living Machines 2016, Edinburgh, UK, July 19-22, 2016. Proceedings. Lepora, N. F., Mura, A., Mangan, M., Verschure, P. F. M. J., Desmulliez, M. & Prescott, T. J. (eds.). Springer, Vol. 9793. p. 131-143 13 p. (Lecture Notes in Computer Science; vol. 9793).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Biomimetics
Design Process
Biological Models
Qualitative Analysis
System Design

Design of conformal wideband antennas for capsule endoscopy within a body tissue environment

Faerber, J., Cummins, G. & Desmulliez, M. P. Y., 4 Oct 2016, Proceedings of the 46th European Microwave Conference . p. 1223-1226 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Megasound Acoustic Surface Treatment Process in the Printed Circuit Board Industry

Jones, T., Flynn, D. & Desmulliez, M. P. Y., 2 Jun 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 7514855

Research output: Chapter in Book/Report/Conference proceedingConference contribution

printed circuits
circuit boards
surface treatment
industries
acoustics

Progress Towards a Multi-Modal Capsule Endoscopy Device Featuring Microultrasound Imaging

Lay, H. S., Qiu, Y., Al-Rawhani, M., Beeley, J., Poltarjonoks, R., Seetohul, V., Cumming, D., Cochran, S., Cummins, G., Desmulliez, M. P. Y., Wallace, M., Trolier-McKinstry, S., McPhillips, R., Cox, B. F. & Demore, C., 3 Nov 2016, 2016 IEEE International Ultrasonics Symposium (IUS). IEEE, 7728692. (IEEE International Ultrasonics Symposium : proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
capsules
transducers
application specific integrated circuits
viability
endoscopes

Sonopill Pathfinder: Rapid Prototyping for Ultrasound Capsule Endoscopy

Cummins, G., Desmulliez, M. P. Y., Hand, D. P., Wlodarczyk, K. L., Demore, C. E. M., Lay, H., Seetohul, V., Cox, B., Cochran, S. & Qiu, Y., 2016, Proceedings of The Hamlyn Symposium on Medical Robotics: 25-28 June 2016, Imperial College London and the Royal Geographical Society. Yang, G-Z. & Darzi, A. (eds.). p. 102-103 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
2015

A compact packaging technique for the integration of ultrasound probes in surgical needles

Schiavone, G., Desmulliez, M. P. Y., Jones, T., Price, D., McPhillips, R., Qiu, Z., Demore, C. E. M., Cochran, S., Mahboob, S. O., Jiang, Y., Meggs, C. & Button, T. W., 16 Jul 2015, Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2015 Symposium on. IEEE, 7160970

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
needles
Needles
Packaging
Ultrasonics

Characterisation of adhesive bonds for ingestible biomedical applications

Cummins, G. & Desmulliez, M. P. Y., 2015, 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC). IEEE, 7412391

Research output: Chapter in Book/Report/Conference proceedingConference contribution

adhesives
Adhesives
Imaging techniques
adhesive bonding
piezoelectric transducers

Computational electrohydrodynamics in the fabrication of hollow polymer microstructures

Tonry, C., Patel, M., Desmulliez, M. P. Y., Yu, W. & Bailey, C., May 2015, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2015 16th International Conference on. IEEE, 7103153

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrohydrodynamics
Fabrication
Microstructure
Contact angle
Masks

Conformal meander shaped antenna for biotelemetry in endoscopic capsules

Faerber, J. & Desmulliez, M. P. Y., 2015, 2015 Loughborough Antennas & Propagation Conference (LAPC). IEEE, 4 p. 7366056

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Biotelemetry
Antennas
Telemetering
Software packages
Tissue

Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuators

Schiavone, G., Ng, J. H., Record, P. M., Shang, X., Wlodarczyk, K. L., Hand, D. P., Cummins, G. & Desmulliez, M. P. Y., 2015, 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings. IEEE, p. 246-249 4 p. 7048373

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition
MEMS
Actuators
Microactuators
Micromachining

Ex-vivo navigation of neurosurgical biopsy needles using microultrasound transducers with M-mode imaging

McPhillips, R., Qiu, Z., Jiang, Y., Mahboob, S. O., Wang, H., Meggs, C., Schiavone, G., Sanmartin, D. R., Eljamel, S., Desmulliez, M. P. Y., Button, T., Cochran, S. & Demore, C. E. M., 2015, 2015 IEEE International Ultrasonics Symposium Proceedings. IEEE, p. 1-4 4 p. (IEEE International Ultrasonics Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Simulation of an eddy current based inductive position sensor

Gao, J., Watson, D. E. G. & Desmulliez, M. P. Y., 2015, 2015 1st URSI Atlantic Radio Science Conference (URSI AT-RASC). IEEE, 7303221

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Eddy currents
recipient
simulation
Sensors
Feedback
2014

15 MHz single element ultrasound needle transducers for neurosurgical applications

Jiang, Y., Meggs, C., Button, T., Schiavone, G., Desmulliez, M. P. Y., Qiu, Z., Mahboob, S., McPhillips, R., Démoré, C. E. M., Casey, G., Eljamel, S., Cochran, S. & Sanmartin, D. R., 2014, IEEE International Ultrasonics Symposium, IUS. IEEE, p. 687-690 4 p. 6932310

Research output: Chapter in Book/Report/Conference proceedingConference contribution

needles
transducers
surgery
brain
echoes

Advanced electrical array interconnections for ultrasound probes integrated in surgical needles

Schiavone, G., Jones, T., Price, D., McPhillips, R., Qiu, Z., Demore, C. E. M., Jiang, Y., Meggs, C., Mahboob, S. O., Eljamel, S., Button, T. W., Cochran, S. & Desmulliez, M. P. Y., 2014, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. IEEE, p. 88-93 6 p. 7028266

Research output: Chapter in Book/Report/Conference proceedingConference contribution

needles
probes
transducers
printed circuits
circuit boards

Effect of seed layers on the performance of planar spiral microinductors

Walker, R., Sirotkin, E., Terry, J. G., Smith, S., Desmulliez, M. P. Y. & Walton, A. J., 1 Jan 2014, IEEE International Conference on Microelectronic Test Structures. IEEE, p. 135-140 6 p. 6841481

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Seed
Nickel
Copper
Magnetic cores
Microelectronics

Integration of Microfluidic Channels with Frequency Selective Surfaces for Sensing and Tuning

Desmulliez, M. P. Y., Pavuluri, S. K., Flynn, D., Mateo-Segura, C. & McKeever, E., 2014, The 8th European Conference on Antennas and Propagation (EuCAP 2014). IEEE, p. 133-136 4 p. (Proceedings of the European Conference on Antennas and Propagation).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
selective surfaces
tuning
near fields
simulators
apertures
2013

Micromechanical test structures for the characterisation of electroplated NiFe cantilevers and their viability for use in MEMS switching devices

Schiavone, G., Smith, S., Murray, J., Terry, J. G., Desmulliez, M. P. Y. & Walton, A. J., Aug 2013, 2013 IEEE International Conference on Microelectronic Test Structures (ICMTS), 25-28 March 2013, Osaka, Japan. NEW YORK: IEEE, p. 13-18 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Numerical Modeling of the Electroplating Process for Microvia Fabrication

Strusevich, N., Bailey, C., Costello, S., Patel, M. & Desmulliez, M., Apr 2013, 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). NEW YORK: IEEE, p. 1-6 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Test Structures for Electrical Evaluation of High Aspect Ratio TSV Arrays Fabricated Using Planarised Sacrificial Photoresist

Zhang, R., Li, Y., Murray, J., Bunting, A. S., Smith, S., Dunare, C. C., Stevenson, J. T. M., Desmulliez, M. P. & Walton, A. J., 2013, 2013 IEEE INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES (ICMTS). NEW YORK: IEEE, p. 37-42 6 p. (IEEE International Conference on Microelectronic Test Structures).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Costello, S., Strusevich, N., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., Price, D., Bennet, M., Jones, A. C. & Desmulliez, M. P. Y., 2012, DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Piscataway (New Jersey): IEEE, p. 98-102 5 p. 6235340

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Polychlorinated biphenyls
Electrodeposition
Aspect ratio
Copper
Ions

Progress towards filling through silicon vias with conductive inks

Cummins, G., Ng, J. H-G., Desmulliez, M. P. Y., Kay, R. W., Walton, A. J. & Terry, J. G., 2012, IEEE 14th Electronics Packaging Technology Conference (EPTC), 2012. IEEE, p. 691-694 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ink
Printing
Electronics packaging
Silicon
3D printers
2011

Agile MEMS packaging for mass customized MEMS products

Kaufmann, J., Flynn, D., Brown, K. E. & Desmulliez, M. P. Y., 11 May 2011, 2011 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), Aix-en-Provence, France. IEEE

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Ng, J. H. G., Ssekitoleko, R. T., Flynn, D., Kay, R. W., Démoré, C., Cochran, S. & Desmulliez, M. P. Y., 2011, EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. Piscataway (New Jersey): IEEE, 6142354

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ultrasonic transducers
Medical applications
Photolithography
Needles
Transducers

Optimization and characterization of drop-on-demand inkjet printing process for platinum organometallic inks

Cummins, G., Desmulliez, M. P. Y., Terry, J. & Kay, R. W., Dec 2011, IEEE 13th Electronics Packaging Technology Conference (EPTC), 2011. IEEE, p. 256 - 261 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Organometallics
Ink
Printing
Platinum
Microsystems
2010

Advances in the design and test of a novel open ended microwave oven

Pavuluri, S. K., Tilford, T., Goussetis, G., Desmulliez, M. P. Y., Ferenets, M., Adamietz, R., Eicher, F. & Bailey, C., 2010, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. p. 247-252 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microwave ovens
Curing
Ovens
Heating
Microwaves

Bespoke interconnect technologies for optoelectronic and biomedical products

Desmulliez, M. P. Y. & Flynn, D., 2010, 2010 International Symposium on Advanced Packaging Materials: Microtech, APM '10. p. 1-4 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Optoelectronic devices
Light emitting diodes
Ultrasonic transducers
Microsystems
Silicon wafers

Biofluid behaviour in 3D microchannel systems: Numerical analysis and design development of 3D microchannel biochip separators

Xue, X., Marson, S., Patel, M. K., Attia, U. M., Bailey, C., O'Neill, W., Topham, D. & Desmulliez, M. P. Y., 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 1021-1030 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Biochips
Microchannels
Separators
Numerical analysis
Laminar flow

Experimental investigation of open-ended microwave oven assisted encapsulation process

Pavuluri, S. K., Ferenets, M., Goussetis, G., Desmulliez, M. P. Y., Tilford, T., Adamietz, R., Muller, G., Eicher, F. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microwave ovens
Encapsulation
Curing
Ovens
Heating

In-situ test structures for ultra low leak detection

Millar, S., Desmulliez, M. P. Y., Cargill, S. & McCracken, S., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Leak detection
MEMS
Calibration
Vacuum
Fabrication

Label-free chemical/biochemical sensing device based on an integrated microfluidic channel within a waveguide resonator

McKeever, E., Pavuluri, S. K., Lopez Villarroya, R., Goussetis, G., Kavanagh, D. M., Mohammed, M. I. & Desmulliez, M. P. Y., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microfluidics
Labels
Resonators
Waveguides
Microwave resonators

Laser-based joining for the packaging of miniature optoelectronic devices

Hand, D. P., Lorenz, N., Smith, M. D., Millar, S. & Desmulliez, M., 2010, Laser-based Micro- and Nanopackaging and Assembly IV. Vol. 7585.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

optoelectronic devices
packaging
lasers
heating
manufacturing

Leak detection methods for glass capped and polymer sealed MEMS packages

Millar, S., Desmulliez, M. P. Y. & McCracken, S., 2010, Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2010. p. 10-15 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

microelectromechanical systems
glass
polymers
Raman spectroscopy
helium

Numerical analysis of microwave underfill cure in ball-grid packages

Tilford, T., Ferenets, M., Adamietz, R., Pavuluri, S. K., Morris, J. E., Desmulliez, M. P. Y. & Bailey, C., 2010, Electronics System Integration Technology Conference, ESTC 2010 - Proceedings.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ball grid arrays
Curing
Numerical analysis
Microwaves
Microwave ovens

Numerical analysis of polymer cure kinetics in isotropic conductive adhesives

Tilford, T., Morris, J. E., Ferenets, M., Rajaguru, P. R., Pavuluri, S., Desmulliez, M. P. Y. & Bailey, C., 2010, ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. p. 412-416 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Numerical analysis
Adhesives
Kinetics
Polymers
Numerical models