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Research Output

2008

Selection of wavelet for de-noising PD waveforms for prognostics and diagnostics of aircraft wiring

Desai, C., Brown, K. E., Desmulliez, M. P. Y. & Sutherland, A., 2008, 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008. IEEE, p. 17-20 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Some applications of magnetic MEMS

Flynn, D. & Desmulliez, M., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 210-213 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ultra-violet direct patterning of metal on polyimide

Ng, J. H. G., Desmulliez, M. P. Y., Prior, K. A. & Hand, D. P., 2008, In : Micro and Nano Letters. 3, 3, p. 82-89 8 p.

Research output: Contribution to journalArticle

UV direct-writing of metals on polyimide

Ng, J. H. G., Desmulliez, M. P. Y., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 360-363 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

UV direct-writing of metals on polyimide substrates

Ng, J. H. G., Desmulliez, M. P. Y., Lamponi, M., Moffat, B. G., Walker, A. C., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 691-694 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2007

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 338-342 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An analysis of a microfabricated solenoid inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 1. p. 556-561 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A novel RF-curing technology for microelectronics and optoelectronics packaging

Sinclair, K. I., Desmulliez, M. P. Y. & Sangster, A. J., 2007, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Vol. 2. p. 1149-1157 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Characterization of core materials for microscale magnetic components operating in the megahertz frequency range

Flynn, D., Toon, A., Allen, L., Dhariwal, R. & Desmulliez, M. P. Y., Jul 2007, In : IEEE Transactions on Magnetics. 43, 7, p. 3171-3180 10 p.

Research output: Contribution to journalArticle

Computational modelling for reliable flip-chip packaging at sub-100 μm pitch using isotropic conductive adhesives

Stoyanov, S., Kay, R., Bailey, C. & Desmulliez, M., Jan 2007, In : Microelectronics Reliability. 47, 1, p. 132-141 10 p.

Research output: Contribution to journalArticle

Evaluation of manufacturing techniques for a minifluidics demonstrator system

Kersaudy-Kerhoas, M., Kaufman, J. G., Attia, U. M., Marson, S., Allen, D., Douglas, A., O'Neill, W., Summersgill, P., Ryan, T. & Desmulliez, M., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Factors affecting user performance in haptic assembly

Lim, T., Ritchie, J. M., Dewar, R. G., Corney, J. R., Wilkinson, P., Calis, M., Desmulliez, M. & Fang, J. J., Oct 2007, In : Virtual Reality. 11, 4, p. 241-252 12 p.

Research output: Contribution to journalArticle

Integration of IC technology with MEMS: silicon+ technology for the future

Walton, A. J., Stevenson, J. T. M., Underwood, I., Terry, J., Smith, S., Parkes, W., Dunare, C., Lin, H., Li, Y., Henderson, R., Renshaw, D., Muir, K., Desmulliez, M. P. Y., Flynn, D., MacIntosh, M. J., Holland, W. S., Murray, A. F., Tang, T. B., Bunting, A. & Gundlach, A. M., 2007, 2007 IET Seminar on Micro Electro-Mechanical Systems. Institution of Engineering and Technology, 11 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS-based packaging of a UV-LED array

Luetzelschwab, M., Weiland, D., Abraham, E. & Desmulliez, M. P. Y., 2007, In : Micro and Nano Letters. 2, 4, p. 99-102 4 p.

Research output: Contribution to journalArticle

Microengineered two-dimensional arrays of monomode optical fibers

Weiland, D., Desmulliez, M. P. Y., Luetzelschwab, M., Missoffe, A. & Beck, C., Dec 2007, In : Journal of Microelectromechanical Systems. 16, 6, p. 1506-1514 9 p.

Research output: Contribution to journalArticle

Microwave curing of materials for high density packaging

Goussetis, G., Sinclair, K. I., Sangster, A. J., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Multiphysics simulation of microwave curing in micro-electronics packaging applications

Tilford, T., Sinclair, K. I., Bailey, C., Desmulliez, M. P. Y., Goussettis, G., Parrott, A. K. & Sangster, A. J., 2007, In : Soldering and Surface Mount Technology. 19, 3, p. 26-33 8 p.

Research output: Contribution to journalArticle

Open ended microwave oven for flip-chip assembly

Sinclair, K. I., Sangster, A. J., Goussetis, G., Desmulliez, M. P. Y., Tilford, T., Parrott, A. K. & Bailey, C., 2007, Proceedings of the 37th European Microwave Conference, EUMC. p. 620-623 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The evolution of paste pressure during stencil printing

Clements, D. J., Desmulliez, M. P. Y. & Abraham, E., 2007, In : Soldering and Surface Mount Technology. 19, 3, p. 9-14 6 p.

Research output: Contribution to journalArticle

The implementation of cosserat theory into haptic sensing technology for large deflection beam model

Calis, M., Laghrouche, O. & Desmulliez, M. P. Y., 2007, ICRM 2007 - 4th International Conference on Responsive Manufacturing.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process

Kay, R. W., Stoyanov, S., Glinski, G. P., Bailey, C. & Desmulliez, M. P. Y., Mar 2007, In : IEEE Transactions on Components and Packaging Technologies. 30, 1, p. 129-136 8 p.

Research output: Contribution to journalArticle

Variable frequency microwave curing of polymer materials in microelectronics packaging applications

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2007, 9th Electronics Packaging Technology Conference, EPTC 2007. p. 791-796 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2006

A design study of microscale magnetic components for operation in the MHz frequency range

Flynn, D., Dhariwal, R. S. & Desmulliez, M. P. Y., 1 Sep 2006, In : Journal of Micromechanics and Microengineering. 16, 9, p. 1811-1818 8 p., 008.

Research output: Contribution to journalArticle

A Haptic Assembly, Machining and Manufacturing System (HAMMS) Approach

Lim, T., Calis, M., Ritchie, J. M., Corney, J. R., Dewar, R. G. & Desmulliez, M. P. Y., Mar 2006, p. 27. 1 p.

Research output: Contribution to conferencePaper

Assessment of microinductors for DC-DC converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M., 2006, 2006 International Conference on Electronic Materials and Packaging, EMAP.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A Structural Assessment of Haptic-based Assembly Processes

Lim, T., Dewar, R. G., Calis, M., Ritchie, R. M., Corney, J. R. & Desmulliez, M. P. Y., Mar 2006, p. 29. 1 p.

Research output: Contribution to conferencePaper

Computer modeling of a micro-manufactured one-turn inductor

Hua, L., Flynn, D., Bailey, C. & Desmulliez, M., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 37-42 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design, manufacture and testing of microengineered stencils used for sub 100 micron wafer level bumping

Gorman, N. J., Kay, R. W., Roney, I. & Desmulliez, M. P. Y., 2006, 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06. p. 323-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication process of a micro-inductor utilising a magnetic thin film core

Flynn, D., Sudan, N. S., Toon, A. & Desmulliez, M. P. Y., 1 Sep 2006, In : Microsystem Technologies. 12, 10-11, p. 923-933 11 p.

Research output: Contribution to journalArticle

Microengineered dynamometer for microfan thrust measurement

Dhariwal, R., Leonard, M., Desmulliez, M. P. Y., Reuben, B. & Armstrong, J., 2006, In : Electronics Letters. 42, 24, p. 1394-1395 2 p.

Research output: Contribution to journalArticle

Microscaile magnetic components for DC-DC converter applications

Flynn, U. & Desmulliez, M. P. Y., 2006, Institution of Engineering and Technology Seminar on MEMS Sensors and Actuators, ICEPT. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscale magnetic components for DC-DC converter applications

Flynn, D. & Desmulliez, M. P. Y., 2006, IET Seminar on MEMS Sensors and Actuators. 11367 ed. Vol. 2006. p. 215-222 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Reliability modelling and analysis of thermal MEMS

Muratet, S., Lavu, S., Fourniols, J. Y., Bell, G. & Desmulliez, M. P. Y., 1 Apr 2006, In : Journal of Physics: Conference Series. 34, 1, p. 235-240 6 p.

Research output: Contribution to journalArticle

Sub-100 micron pitch stencil printing for wafer scale bumping

Desmulliez, M. P. Y., Kay, R. W., Abraham, E., De Gourcuff, E., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2006, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Two-dimensional monomode optical fibre array manufacture using microengineering techniques

Weiland, D., Luetzelschwab, M. & Desmulliez, M. P. Y., Sep 2006, In : Microsystem Technologies. 12, 10-11, p. 965-972 8 p.

Research output: Contribution to journalArticle

2005

Experimental study of a radial micro-channel cooling plate

Poppe, A., Horváth, G., Bognár, G., Kohári, Z., Desmulliez, M. P. Y. & Rencz, M., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 664-669 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fabrication process of a micro-inductor utilising a magnetic thin film core

Flynn, D., Desmulliez, M. P. Y. & Toon, A., 30 May 2005, p. 38-43. 6 p.

Research output: Contribution to conferencePaper

Low-cost active-alignment of single-mode fiber-arrays

Weiland, D., Luetzelschwab, M., Desmulliez, M. P. Y., Missoffe, A. & Beck, C., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 199-203 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Manufacture and characterisation of micro-engineered DC-DC power converter using UV-LIGA process

Flynn, D., Toon, A. & Desmulliez, M. P. Y., 24 Nov 2005, In : Electronics Letters. 41, 24, p. 1351-1353 3 p.

Research output: Contribution to journalArticle

Manufacture of two-dimensional monomode optical fiber array using MEMS technology

Weiland, D., Missoffe, A. C. M., Luetzelschwab, M., Desmulliez, M. P. Y. & Beck, C., 2005, Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005. Vol. 2. p. 477-482 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microscale magnetic components for the application of DC-DC converters operating in the 1-10 MHz range

Flynn, D., Toon, A. & Desmulliez, M., 2005, Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging. Vol. 2005. p. 192-198 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Operation of an optoelectronic crossbar switch containing a terabit-per-second free-space optical interconnect

Walker, A. C., Fancey, S. J., Desmulliez, M. P. Y., Forbes, M. G., Casswell, J. J., Buller, G. S., Taghizadeh, M. R., Dines, J. A. B., Stanley, C. R., Pennelli, G., Boyd, A. R., Pearson, J. L., Horan, P., Byrne, D., Hegarty, J., Eitel, S., Gauggel, H. P., Gulden, K. H., Gauthier, A., Benabes, P. & 3 others, Gutzwiller, J. L., Goetz, M. & Oksman, J., Jul 2005, In : IEEE Journal of Quantum Electronics. 41, 7, p. 1024-1036 13 p.

Research output: Contribution to journalArticle

Stencil printing technology for wafer level bumping at sub-100 micron pitch using Pb-free alloys

Kay, R. W., De Gourcuff, E., Desmulliez, M. P. Y., Jackson, G. J., Steen, H. A. H., Liu, C. & Conway, P. P., 2005, Proceedings - Electronic Components and Technology Conference. Vol. 1. p. 848-854 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Submicron alignment of a two-dimensional array of multiple single-mode fibers

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., Dec 2005, In : IEEE Photonics Technology Letters. 17, 12, p. 2634-2636 3 p.

Research output: Contribution to journalArticle

Sub process challenges in ultra fine pitch stencil printing of type-6 and type-7 Pb-free solder pastes for flip chip assembly applications

Jackson, G. J., Hendriksen, M. W., Kay, R. W., Desmulliez, M., Durairaj, R. K. & Ekere, N. N., 2005, In : Soldering and Surface Mount Technology. 17, 1, p. 24-32 9 p.

Research output: Contribution to journalArticle

Thermal characterization of a radial micro-channel cooling plate

Bognár, G., Horváth, G., Kohári, Z., Pang, A. J., Desmulliez, M. P. Y., Poppe, A., Rencz, M. & Székely, V., 2005, Proceedings of the 21st IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium. p. 135-140 6 p. (IEEE/CPMT Semiconductor Thermal Measurement and Management Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Two-dimensional monomode fibre array manufacture using UV-LIGA process

Weiland, D., Lützelschwab, M. & Desmulliez, M. P. Y., 18 Aug 2005, In : Electronics Letters. 41, 17, p. 978-979 2 p.

Research output: Contribution to journalArticle