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Research Output

2008

3D-mintegration: The design and manufacture of 3D miniaturised integrated products

Desmulliez, M. P. Y. & Topham, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 737-741 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Adaptive packaging solution for a microlens array placed over a micro-UV-LED array

Luetzelschwab, M., Weiland, D. & Desmulliez, M. P. Y., 2008, Micro-Assembly Technologies and Applications: IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS'2008) Chamonix, France February 10-13, 2008. Vol. 260. p. 129-138 10 p. (IFIP International Federation for Information Processing; vol. 260).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Advanced microwave oven for rapid curing of encapsulant

Sinclair, K. I., Tilford, T., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 551-556 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K., Desai, C., Flynnl, D. & Sutherland, A., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

A micro-fabricated current sensor for arc fault detection of aircraft wiring

Moffat, B. G., Desmulliez, M. P. Y., Brown, K. E., Desai, C., Flynn, D. & Sutherland, A., 2008, 2nd Electronics System-Integration Technology Conference, 2008. IEEE, p. 299-304 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Challenges in Modelling Biofluids in Microchannels

Xue, X., Patel, M. K., Bailey, C., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 287-292 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparison of encapsulant curing with convection and microwave systems

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International: 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference, IEMT 2008; Penang; Malaysia; 4 November 2008 through 6 November 2008. (Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design, Modeling and Characterization of a microinductor for future DC-DC power converters

Flynn, D., Lu, H., Bailey, C. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 577-582 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Design and fabrication of a miniaturized three-axis accelerometer for measuring heart wall motion

Lowrie, C., Desmulliez, M., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 194-197 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Design and fabrication of an implantable three-axis accelerometer for post-surgery monitoring of heart wall motion

Lowrie, C., Desmulliez, M. P. Y., Hoff, L., Elle, O. J. & Fosse, E., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 435-440 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design methodology and manufacture of a microinductor

Flynn, D. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 364-369 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Embedded health monitoring strategies for aircraft wiring systems

Xu, Z., Saha, S., Koltsov, D., Richardson, A., Honary, B., Hannu, J., Sutherland, A., Moffat, B. G. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 463-469 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Failure mechanisms of legacy aircraft wiring and interconnects

Moffat, B. G., Abraham, E., Desmulliez, M. P. Y., Koltsov, D. & Richardson, A., Jun 2008, In : IEEE Transactions on Dielectrics and Electrical Insulation. 15, 3, p. 808-822 15 p., 4543119.

Research output: Contribution to journalArticle

19 Citations (Scopus)

Haptic sensing for MEMS with application for cantilever and casimir effect

Calis, M. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 80-84 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Sinclair, K. L. & Desmulliez, M. P. Y., 2008, PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Impact of assembly process technologies on electronic packaging materials

Tilford, T., Bailey, C., Parrott, A. K., Rizvi, J., Yin, C., Sinclair, K. I. & Desmulliez, M. P. Y., 2008, Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Kaufmann, J., Desmulliez, M. P. Y., Price, D., Hughes, M., Strussevich, N. & Bailey, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1235-1239 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Integrated Biomedical Device for Blood Preparation

Kersaudy-Kerhoas, M., Kavanagh, D., Xue, X., Patel, M., Bailey, C., Dhariwal, R. S. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 447-452 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Megasonic enhanced electrodeposition

Kaufmann, J., Desmulliez, M. P. Y. & Price, D., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 370-372 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)

Megasonic enhanced wafer bumping process to enable high density electronics interconnection

Tian, Y., Kaufmann, J., Liu, C., Hutt, D. A., Stevens, B. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 725-729 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Micro-fabrication on 3-D surface by electrostatic induced lithography

Yu, W., Cargill, S., Leonard, M. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 111-116 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

MicroLens/UV-LED array packaging for dynamic and static alignment

Luetzelschwab, M., Desmulliez, M. P. Y. & Weiland, D., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1121-1126 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Microsystems technology for the separation of fetal cells from maternal blood

Kavanagh, D. M., Flynn, D., Amalou, F., Moffat, B. G., Dhariwal, R. & Desmulliez, M. P. Y., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 785-789 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microsystems Technology for the Separation of Foetal Cells from Maternal Blood

Flynn, D., Desmulliez, M. P. Y., Dhariwal, R. S. & Kavanagh, D., 1 Sep 2008.

Research output: Contribution to conferencePaper

Miniaturised optical encoder

Carr, J., Desmulliez, M. P. Y., Weston, N., McKendrick, D., Cunningham, G., McFarland, G., Meredith, W., McKee, A., Langton, C. & Eddie, I., 2008, Optical System Alignment and Tolerancing II. Vol. 7068.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Minimising the risk of defects in nano-imprint forming

Stoyanov, S., Amalou, F., Sinclair, K., Bailey, C. & Desmulliez, M., 2008, 2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008. p. 367-372 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modelling MEMS structures using cosserat theory

Calis, M., Lagrouche, O. & Desmulliez, M. P. Y., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 77-79 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modelling the Nano-Imprint Forming process for the production of miniaturised 3D structures

Stoyanov, S., Amalou, F., Sinclair, K., Bailey, C. & Desmulliez, M. P. Y., 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Numerical analysis of thermal stresses induced during VFM encapsulant curing

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, 2008 31st International Spring Seminar on Electronics Technology: Reliability and Life-time Prediction, ISSE 2008. p. 348-353 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Numerical simulation of encapsulant curing within a Variable Frequency Microwave processing system

Tilford, T., Sinclair, K. I., Goussetis, G., Bailey, C., Desmulliez, M. P. Y., Parrott, A. K. & Sangster, A. J., 2008, EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Open-ended microwave oven for flip-chip assembly

Sangster, A. J., Sinclair, K. I., Desmulliez, M. P. Y. & Goussetis, G., Feb 2008, In : IET Microwaves, Antennas and Propagation. 2, 1, p. 53-58 6 p.

Research output: Contribution to journalArticle

12 Citations (Scopus)

Open ended microwave oven for packaging

Sinclair, K. I., Tilford, T., Desmulliez, M. Y. P., Goussetis, G., Bailey, C., Parrott, K. & Sangster, A. J., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 16-20 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Optical encoder readhead chip

Carr, J., Desmulliez, M., Weston, N., McKendrick, D., Cunningham, G., McFarland, G., Meredith, W., McKee, A., Langton, C. & Eddie, I., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 797-801 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Optimization of an open-ended microwave oven for microelectronics packaging

Sinclair, K. I., Goussetis, G., Desmulliez, M. P. Y., Sangster, A. J., Tilford, T., Bailey, C. & Parrott, A. K., Nov 2008, In : IEEE Transactions on Microwave Theory and Techniques. 56, 11, p. 2635-2641 7 p.

Research output: Contribution to journalArticle

10 Citations (Scopus)

Polymer curing within an optimised open-ended microwave oven

Sinclair, K. I., Goussetis, G., Desmulliez, M. P. Y., Sangster, A. J., Tilford, T., Bailey, C. & Parrott, K., 2008, Proceedings of the 38th European Microwave Conference, EuMC 2008. p. 17-20 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Porous alumina based capacitive MEMS RH sensor

Juhász, L., András, V. V., Veronika, T. H., Desmulliez, M. P. Y. & Dhariwal, R. S., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 381-385 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Recent advances in microparticle continuous separation

Kersaudy-Kerhoas, M., Dhariwal, R. & Desmulliez, M. P. Y., Mar 2008, In : IET Nanobiotechnology. 2, 1, p. 1-13 13 p.

Research output: Contribution to journalArticle

87 Citations (Scopus)

Selection of wavelet for de-noising PD waveforms for prognostics and diagnostics of aircraft wiring

Desai, C., Brown, K. E., Desmulliez, M. P. Y. & Sutherland, A., 2008, 2008 Annual Report Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2008. IEEE, p. 17-20 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

12 Citations (Scopus)

Some applications of magnetic MEMS

Flynn, D. & Desmulliez, M., 2008, Proceedings of the 15th IEEE International Conference on Electronics, Circuits and Systems, ICECS 2008. p. 210-213 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Ultra-violet direct patterning of metal on polyimide

Ng, J. H. G., Desmulliez, M. P. Y., Prior, K. A. & Hand, D. P., 2008, In : Micro and Nano Letters. 3, 3, p. 82-89 8 p.

Research output: Contribution to journalArticle

27 Citations (Scopus)

UV direct-writing of metals on polyimide

Ng, J. H. G., Desmulliez, M. P. Y., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, DTIP of MEMS and MOEMS - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. p. 360-363 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

UV direct-writing of metals on polyimide substrates

Ng, J. H. G., Desmulliez, M. P. Y., Lamponi, M., Moffat, B. G., Walker, A. C., McCarthy, A., Suyal, H., Prior, K. A. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 691-694 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)
2009

A direct-writing approach to the micro-patterning of copper onto polyimide

Ng, J. H. G., Desmulliez, M. P. Y., Lamponi, M., Moffat, B. G., McCarthy, A., Suyal, H., Walker, A. C., Prior, K. A. & Hand, D. P., 15 May 2009, In : Circuit World. 35, 2, p. 3-17 15 p.

Research output: Contribution to journalArticle

16 Citations (Scopus)

Advances in laser based joining processes of micro-devices using localised heating

Lorenz, N., Smith, M. D., Millar, S., Desmulliez, M. & Hand, D. P., 2009, ICALEO 2009 - 28th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. Vol. 102. p. 999-1007 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design, fabrication, and characterization of flip-chip bonded microinductors

Flynn, D. & Desmulliez, M. P. Y., Aug 2009, In : IEEE Transactions on Magnetics. 45, 8, p. 3055-3063 9 p., 5170214.

Research output: Contribution to journalArticle

6 Citations (Scopus)
4 Citations (Scopus)

Effect of fluid dynamics and device mechanism on biofluid behaviour in microchannel systems: Modelling biofluids in a microchannel biochip separator

Xue, X., Patel, M. K., Kersaudy-Kerhoas, M., Bailey, C., Desmulliez, M. P. Y. & Topham, D., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 179-186 8 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

Desmulliez, M. P. Y., Pang, A. J., Leonard, M., Dhariwal, R. S., Yu, W., Abraham, E., Bognár, G., Poppe, A., Horvath, G., Kohari, Z., Rencz, M., Emerson, D., Barber, R. W., Slattery, O., Waldron, F. & Cordero, N., 2009, In : IEEE Transactions on Components and Packaging Technologies. 32, 1, p. 20-29 10 p.

Research output: Contribution to journalArticle

11 Citations (Scopus)

Fabrication and testing of microfluidic devices for blood cell separation

Kavanagh, D., Kersaudy-Kerhoas, M. & Desmulliez, M. P. Y., Sep 2009, Brunel Institute for Bioengineering (BIB), The Brunel Collection. Brunel, UK: Brunel University

Research output: Chapter in Book/Report/Conference proceedingConference contribution