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David Flynn

Dr

 https://orcid.org/0000-0002-1024-3618
20052019
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Research Output 2005 2019

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Conference article
2019

Extreme environment interconnects and packaging for power electronics

Campos-Zatarain, A., Hinton, J., Mirgkizoudi, M., Li, J., Harris, R., Kay, R. W. & Flynn, D., 15 Apr 2019, In : Journal of Engineering.

Research output: Contribution to journal › Conference article

Open Access
File
Power electronics
Packaging
Interdiffusion (solids)
Substrates
Printing