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Research Output 1990 2019

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Patent
2010

Encapsulation method

Wang, C. & Zeng, J., 25 Mar 2010, IPC No. B81B7/00; B81C1/00, Patent No. GB 2476209B, Priority date 19 Sep 2008

Research output: Patent

2006

Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices

Wang, C., Hand, D. P. & Bardin, F., 30 Nov 2006, IPC No. B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01), Patent No. PCT/GB2006/001971, Priority date 27 May 2005

Research output: Patent

packaging
adhesives
microelectromechanical systems
heat
lasers
2002

Linear array devices for detecting an analyte or for screening

McKinnon, A. W. & Wang, C., 13 Jun 2002, IPC No. B01J19/00 G01N33/543 C12Q1/68, Patent No. WO0245842 (A1), Priority date 5 Dec 2000, Priority No. 0029590.7

Research output: Patent