If you made any changes in Pure these will be visible here soon.

Research Output 1990 2019

Filter
Paper
2003

A bump transfer method for flip chip assembly

Zhang, J. & Wang, C., Dec 2003, p. 321-323. 3 p.

Research output: Contribution to conferencePaper

Flip chip assembly of MEMS inductors

Pang, A. J., Wang, C. & Sangster, A. J., Dec 2003, p. 298-300. 3 p.

Research output: Contribution to conferencePaper