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Research Output 1990 2019

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Conference contribution
2019

Study of multiband resonant absorbers based on modified electric LC resonators

Kanjanasit, K. & Wang, C., 21 Jan 2019, 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON). IEEE, p. 368-371 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Absorber
Resonator
Resonators
absorbers
resonators
2018

A broadband resonant cavity antenna using a metamaterial based on double-side identical arrays

Kanjanasit, K. & Wang, C., 1 Feb 2018, 2017 IEEE Conference on Antenna Measurements and Applications (CAMA). IEEE, p. 51-54 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cavity resonators
Metamaterials
cavity resonators
antennas
Antennas

Joint international master in smart systems integration: University collaboration for improved education

Aasmundtveit, K. E., Wang, C., Rencz, M., Desmulliez, M. P. Y., Ender, F. & Imenes, K., 24 May 2018, 2018 IEEE Global Engineering Education Conference (EDUCON). IEEE, p. 624-629 6 p. (IEEE Global Engineering Education Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Education
Students
graduate
education
university
2017

A high performance micromachined CPW fed aperture coupled compact patch antenna using a double-tuned impedance matching method

Kanjanasit, K. & Wang, C., 19 Jan 2017, 2016 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS). IEEE, 7824736

Research output: Chapter in Book/Report/Conference proceedingConference contribution

patch antennas
impedance matching
Antenna feeders
Microstrip antennas
apertures
2016

Testing and characterisation of electrothermal microgrippers with embedded microheaters

Al Zandi, M., Wang, C., Voicu, R. C. & Muller, R., 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 7514880

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Grippers
Testing
Electric potential
Gold
Temperature
2010

A multi-mode MEMS sensor design to support system test and health & usage monitoring applications

Xu, Z., Richardson, A., Koltsov, D., Li, L., Begbie, M. & Wang, C. H., 2010, 2010 15th IEEE European Test Symposium, ETS'10. p. 263-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Health
Monitoring
Sensors
Built-in self test

Near-eutectic Sn-Ag-Cu solder bumps formation for flip-chip interconnection by electrodeposition

Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 144-150 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition
Soldering alloys
Eutectics
Deposits
Scanning electron microscopy
2009

BCB-based wafer-level packaging of integrated CMOS/SOI piezoresistive MEMS sensors

Weiland, D., Chaehoi, A., Ray, S., O'Connell, D., Begbie, M. & Wang, C., 2009, 2009 European Microelectronics and Packaging Conference, EMPC 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Sensors
Accelerometers
Amplification

Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging

Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 485-489 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Adhesives
Packaging
Polymers
Glass

Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 278-282 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

solders
electrodeposition
baths
eutectics
iodides

Electrodeposition of Sn-Cu solder alloy for electronics interconnection

Qin, Y., Wassay, A., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 772-777 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition
Soldering alloys
Eutectics
Electronic equipment
Surface active agents

Growth and recrystallization of electroplated copper columns

Liu, J., Liu, C., Conway, P. P., Zeng, J. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 695-700 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

copper
annealing
crystal structure
microstructure
grain size

Integrated sensors for health monitoring in advanced electronic systems

Wang, C. H., Liu, Y., Desmulliez, M. & Richardson, A., 2009, 2009 4th International Design and Test Workshop, IDT 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Health
Monitoring
Sensors
Atmospheric humidity
Microsystems

Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

Changhai, W., Jun, Z. & Yufei, L., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 31-35 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
caps
polymers
lasers

Temperature monitoring in Laser assisted polymer bonding for MEMS packaging using a thin film sensor array

Liu, Y., Zeng, J. & Wang, C., 2009, SAS 2009 - IEEE Sensors Applications Symposium Proceedings. p. 52-55 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
sensors
polymers
thin films
2008

Chip scale studies of BCB based polymer bonding for MEMS packaging

Wang, C. H., Zeng, J., Zhao, K. & Chan, H. L., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1869-1873 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Polymers
Substrates
Seals

Fabrication and assembly of high gain MEMS antennas for wireless communications

Wang, C. H. & Pavuluri, S. K., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1941-1945 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Antennas
Fabrication
Communication
Polymers

Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. p. 122-131 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

frit
illumination
laser beams
scanning
glass

Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 669-677 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

frit
illumination
laser beams
scanning
glass

In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging

Liu, Y., Zeng, J. & Wang, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 199-203 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Process control
Packaging
Lasers
Monitoring

Laser assisted polymer bonding technology for advanced MEMS packaging

Zeng, J. & Wang, C. H., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1225-1229 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
polymers
lasers
beamforming

Localised laser joining of glass to silicon with BCB intermediate layer

Wu, Q., Kloss, S., Lorenz, N., Wang, C., Moore, A. J. & Hand, D. P., 2008, 3rd Pacific International Conference on Applications of Lasers and Optics, PICALO 2008 - Conference Proceedings. p. 859-863 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

glass
temperature sensitive paints
silicon
lasers
heating
2007

A cavity based high gain MEMS antenna for microwave and millimetre wave applications

Pavuluri, S. K., Wang, C. H. & Sangster, A. J., 2007, 2nd European Conference on Antennas and Propagation, EuCAP 2007. 11961 ed. Vol. 2007.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Millimeter waves
MEMS
Microstrip antennas
Microwaves
Antennas
2006

Laser joining of glass to silicon using adhesive for MEMS packaging applications

Bardin, F., Kloss, S., Wang, C. H., Moore, A., Jourdain, A., De Wolf, I. & Hand, D. P., 2006, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6107.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
adhesives
microelectromechanical systems
cavities
glass
2004

A low cost bumping method for flip chip assembly and MEMS integration

Zhang, J. H., Wang, C. H., Pang, A. J. & Zeng, J., 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. p. 171-176 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Costs
Gold
Nickel
Melting point
1995

Design and fabrication of polymer-based asymmetric Fabry-Perot electro-optic modulators

Wang, C. H., Wherrett, B. S. & Harvey, T. G., 1995, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 2449. p. 293-299 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

electro-optics
modulators
fabrication
polymers
light modulation
1990

Submilliwatt optical bistability in nematic liquid crystals at 1.3μm

Wang, C. H., Lloyd, A. D. & Wherrett, B. S., 1990, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 1230. p. 729-732 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

optical bistability
liquid crystals
optimization