Research output per year
Research output per year
- 34 results
Search results
-
2024
A Rapid and Selective Laser Sintering Method of Silver Nanoparticles for High Temperature Electronic Devices Packaging
Liu, G., Wang, C., Bhandari, B. & Swingler, J., 11 Apr 2024, 24th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 10492343Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2023
A Full 3D Printing Method for Monolithic Integration of an Accelerometer and a Force Sensor
Liu, G., Wang, C., Wang, K., Jia, Z., Luo, R. & Ma, W., 1 Mar 2023, 36th IEEE International Conference on Micro Electro Mechanical Systems (MEMS). IEEE, p. 598-601 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
2022
A Fully 3D Printed Accelerometer for Movement Monitoring Applications
Liu, G., Wang, C., Luo, R., Jia, Z., Hou, M. & Ma, W., 10 Jun 2022, 17th IEEE International Conference on Nano/Micro Engineered and Molecular Systems 2022. IEEE, p. 74-77 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Joint International Master in Smart Systems Integrated Solutions
Aasmundtveit, K. E., Wang, C., Rencz, M., Paulasto-Kröckel, M., Imenes, K., Desmulliez, M. P. Y., Ender, F. & Vuorinen, V., 11 Nov 2022, 9th IEEE Electronics System-Integration Technology Conference 2022. IEEE, p. 310-314 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2021
Joint International Master in Smart Systems Integrated Solutions
Aasmundtveit, K. E., Wang, C., Rencz, M., Paulasto-Krockel, M., Imenes, K., Desmulliez, M., Ender, F. & Vuorinen, V., 2 Jul 2021, 2021 Smart Systems Integration (SSI). IEEE, 9466979Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2019
A finite-size superstrate based on identical patch arrays for broadband resonant cavity antennas
Kanjanasit, K. & Wang, C., 23 Dec 2019, 2019 7th International Electrical Engineering Congress (iEECON). IEEE, 8938925Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Study of multiband resonant absorbers based on modified electric LC resonators
Kanjanasit, K. & Wang, C., 21 Jan 2019, 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON). IEEE, p. 368-371 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
V-shaped and Z-shaped SU-8 micro-tweezers with in-plane displacement for micromanipulation
Voicu, R. C., Tibeica, C., Al Zandi, M., Potekhina, A. & Wang, C. H., 7 Oct 2019, 2019 International Conference on Manipulation, Automation and Robotics at Small Scales (MARSS). IEEE, 8860941Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
2018
A broadband resonant cavity antenna using a metamaterial based on double-side identical arrays
Kanjanasit, K. & Wang, C., 1 Feb 2018, 2017 IEEE Conference on Antenna Measurements and Applications (CAMA). IEEE, p. 51-54 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Joint international master in smart systems integration: University collaboration for improved education
Aasmundtveit, K. E., Wang, C., Rencz, M., Desmulliez, M. P. Y., Ender, F. & Imenes, K., 24 May 2018, 2018 IEEE Global Engineering Education Conference (EDUCON). IEEE, p. 624-629 6 p. (IEEE Global Engineering Education Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open AccessFile3 Citations (Scopus)102 Downloads (Pure) -
2017
A high performance micromachined CPW fed aperture coupled compact patch antenna using a double-tuned impedance matching method
Kanjanasit, K. & Wang, C., 19 Jan 2017, 2016 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS). IEEE, 7824736Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
2016
Testing and characterisation of electrothermal microgrippers with embedded microheaters
Al Zandi, M., Wang, C., Voicu, R. C. & Muller, R., 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 7514880Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
11 Citations (Scopus) -
2010
A multi-mode MEMS sensor design to support system test and health & usage monitoring applications
Xu, Z., Richardson, A., Koltsov, D., Li, L., Begbie, M. & Wang, C. H., 2010, 2010 15th IEEE European Test Symposium, ETS'10. p. 263-Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Near-eutectic Sn-Ag-Cu solder bumps formation for flip-chip interconnection by electrodeposition
Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 144-150 7 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2009
BCB-based wafer-level packaging of integrated CMOS/SOI piezoresistive MEMS sensors
Weiland, D., Chaehoi, A., Ray, S., O'Connell, D., Begbie, M. & Wang, C., 2009, 2009 European Microelectronics and Packaging Conference, EMPC 2009.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging
Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 485-489 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection
Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 278-282 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
Electrodeposition of Sn-Cu solder alloy for electronics interconnection
Qin, Y., Wassay, A., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 772-777 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
14 Citations (Scopus) -
Growth and recrystallization of electroplated copper columns
Liu, J., Liu, C., Conway, P. P., Zeng, J. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 695-700 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Integrated sensors for health monitoring in advanced electronic systems
Wang, C. H., Liu, Y., Desmulliez, M. & Richardson, A., 2009, 2009 4th International Design and Test Workshop, IDT 2009.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4 Citations (Scopus) -
Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging
Changhai, W., Jun, Z. & Yufei, L., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 31-35 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
Temperature monitoring in Laser assisted polymer bonding for MEMS packaging using a thin film sensor array
Liu, Y., Zeng, J. & Wang, C., 2009, SAS 2009 - IEEE Sensors Applications Symposium Proceedings. p. 52-55 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
2008
Chip scale studies of BCB based polymer bonding for MEMS packaging
Wang, C. H., Zeng, J., Zhao, K. & Chan, H. L., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1869-1873 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
17 Citations (Scopus) -
Fabrication and assembly of high gain MEMS antennas for wireless communications
Wang, C. H. & Pavuluri, S. K., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1941-1945 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam
Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. p. 122-131 10 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam
Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 669-677 9 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
3 Citations (Scopus) -
In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging
Liu, Y., Zeng, J. & Wang, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 199-203 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Laser assisted polymer bonding technology for advanced MEMS packaging
Zeng, J. & Wang, C. H., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1225-1229 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
Localised laser joining of glass to silicon with BCB intermediate layer
Wu, Q., Kloss, S., Lorenz, N., Wang, C., Moore, A. J. & Hand, D. P., 2008, 3rd Pacific International Conference on Applications of Lasers and Optics, PICALO 2008 - Conference Proceedings. p. 859-863 5 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
4 Citations (Scopus) -
2007
A cavity based high gain MEMS antenna for microwave and millimetre wave applications
Pavuluri, S. K., Wang, C. H. & Sangster, A. J., 2007, 2nd European Conference on Antennas and Propagation, EuCAP 2007. 11961 ed. Vol. 2007.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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2006
Laser joining of glass to silicon using adhesive for MEMS packaging applications
Bardin, F., Kloss, S., Wang, C. H., Moore, A., Jourdain, A., De Wolf, I. & Hand, D. P., 2006, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6107.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
2 Citations (Scopus) -
2004
A low cost bumping method for flip chip assembly and MEMS integration
Zhang, J. H., Wang, C. H., Pang, A. J. & Zeng, J., 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. p. 171-176 6 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
5 Citations (Scopus) -
1995
Design and fabrication of polymer-based asymmetric Fabry-Perot electro-optic modulators
Wang, C. H., Wherrett, B. S. & Harvey, T. G., 1995, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 2449. p. 293-299 7 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus) -
1990
Submilliwatt optical bistability in nematic liquid crystals at 1.3μm
Wang, C. H., Lloyd, A. D. & Wherrett, B. S., 1990, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 1230. p. 729-732 4 p.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1 Citation (Scopus)