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Research Output 1990 2019

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2003

A novel assembly method for chip/wafer bumping and MEMS integration

Wang, C., Pang, A. J., Zhang, J. & Sangster, A. J., Dec 2003, MicroNano Integration, ed H Knobloch & Y Kaminorz, Springer. p. 263-264 2 p.

Research output: Chapter in Book/Report/Conference proceedingChapter

One-dimensional microarrays for genetic testing and diagnostics

Wang, C., Ewins, J., Zhang, S., Lindsell, W. E., Meaden, P. G. & Fotheringham, A. F., Dec 2003, MicroNano Integration, ed. H. Knobloch & Y Kaminorz, Springer. p. 155-162 8 p.

Research output: Chapter in Book/Report/Conference proceedingChapter