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Research Output 1990 2019

2019
Flexible electronics
inks
Silver
Ink
Copper

Study of multiband resonant absorbers based on modified electric LC resonators

Kanjanasit, K. & Wang, C., 21 Jan 2019, 2018 15th International Conference on Electrical Engineering/Electronics, Computer, Telecommunications and Information Technology (ECTI-CON). IEEE, p. 368-371 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Absorber
Resonator
Resonators
absorbers
resonators
2018

A broadband resonant cavity antenna using a metamaterial based on double-side identical arrays

Kanjanasit, K. & Wang, C., 1 Feb 2018, 2017 IEEE Conference on Antenna Measurements and Applications (CAMA). IEEE, p. 51-54 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cavity resonators
Metamaterials
cavity resonators
antennas
Antennas
Open Access
File
Cavity resonators
Coplanar waveguides
Metamaterials
Antenna feeders
Frequency selective surfaces

Design and experimental testing of an electro-thermal microgripper for cell manipulation

Somà, A., Iamoni, S., Voicu, R. C., Muller, R., Al-Zandi, M. H. M. & Wang, C., Feb 2018, In : Microsystem Technologies. 24, 2, p. 1053–1060 8 p.

Research output: Contribution to journalArticle

Grippers
actuation
manipulators
fabrication
finite element method
Oxalates
Silver
Ink
Amines
Ligands

Joint international master in smart systems integration: University collaboration for improved education

Aasmundtveit, K. E., Wang, C., Rencz, M., Desmulliez, M. P. Y., Ender, F. & Imenes, K., 24 May 2018, 2018 IEEE Global Engineering Education Conference (EDUCON). IEEE, p. 624-629 6 p. (IEEE Global Engineering Education Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Open Access
File
Education
Students
graduate
education
university

Silver Oxalate Ink with Low Sintering Temperature and Good Electrical Property

Yang, W., Wang, C. & Arrighi, V., 26 Feb 2018, In : Journal of Electronic Materials. p. 1-12 12 p.

Research output: Contribution to journalArticle

Open Access
File
Oxalates
inks
oxalates
Silver
Ink
2017

A high performance micromachined CPW fed aperture coupled compact patch antenna using a double-tuned impedance matching method

Kanjanasit, K. & Wang, C., 19 Jan 2017, 2016 International Symposium on Intelligent Signal Processing and Communication Systems (ISPACS). IEEE, 7824736

Research output: Chapter in Book/Report/Conference proceedingConference contribution

patch antennas
impedance matching
Antenna feeders
Microstrip antennas
apertures
Open Access
File
inks
Silver
Ink
silver
Decomposition

Laser Sintering of Nano-Ag Particle Paste for High Temperature Electronics Assembly

Liu, W., Wang, C., Wang, C., Jiang, X. & Huang, X., Jul 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1050-1057 8 p.

Research output: Contribution to journalArticle

Open Access
File
sintering
assembly
electronics
lasers
shear strength

Measurement and characterisation of displacement and temperature of polymer based electrothermal microgrippers

Al Zandi, M., Wang, C., Voicu, R. & Muller, R., 31 Jan 2017, In : Microsystem Technologies. p. 1-9 9 p.

Research output: Contribution to journalArticle

Open Access
File
Grippers
Polymers
polymers
Gold
actuation

Nonlinear numerical analysis and experimental testing for an electrothermal SU-8 microgripper with reduced out-of-plane displacement

Voicu, R. C., Al Zandi, M., Muller, R. & Wang, C., 23 Nov 2017, In : Journal of Physics: Conference Series. 922, 1, 012006.

Research output: Contribution to journalArticle

Open Access
File
heaters
numerical analysis
actuation
deflection
actuators
Open Access
File
Graphite
inks
Complexation
Ink
Oxides
2016

Graphene and the related conductive inks for flexible electronics

Yang, W. & Wang, C., 14 Aug 2016, In : Journal of Materials Chemistry C. 4, 30, p. 7193-7207 15 p.

Research output: Contribution to journalReview article

Open Access
File
Flexible electronics
Graphite
Ink
Graphene
Networks (circuits)

Testing and characterisation of electrothermal microgrippers with embedded microheaters

Al Zandi, M., Wang, C., Voicu, R. C. & Muller, R., 2016, 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP). IEEE, 7514880

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Grippers
Testing
Electric potential
Gold
Temperature
2015
File
Liquid crystal polymers
Polymer films
MEMS
Packaging
Lasers

A laser microwelding method for assembly of polymer based microfluidic devices

Jiang, X., Chandrasekar, S. & Wang, C., 1 Mar 2015, In : Optics and Lasers in Engineering. 66, p. 98-104 7 p.

Research output: Contribution to journalArticle

File
microfluidic devices
Microfluidics
Polymers
assembly
Lasers
File
inks
Ink
Copper
Electric properties
electrical properties
2013
Open Access
File
2011

BCB film based SAW humidity sensor

Liu, Y., Wang, C. & Li, Y., 1 Sep 2011, In : Electronics Letters. 47, 18, p. 1012-1014 2 p.

Research output: Contribution to journalArticle

humidity
acoustics
sensors
sensitivity
2010

Accurate temperature monitoring in laser-assisted polymer bonding for MEMS packaging using an embedded microsensor array

Liu, Y., Zeng, J. & Wang, C., Aug 2010, In : Journal of Microelectromechanical Systems. 19, 4, p. 903-910 8 p., 5484452.

Research output: Contribution to journalArticle

Microsensors
MEMS
Packaging
Lasers
Monitoring

A multi-mode MEMS sensor design to support system test and health & usage monitoring applications

Xu, Z., Richardson, A., Koltsov, D., Li, L., Begbie, M. & Wang, C. H., 2010, 2010 15th IEEE European Test Symposium, ETS'10. p. 263-

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Health
Monitoring
Sensors
Built-in self test

Encapsulation method

Wang, C. & Zeng, J., 25 Mar 2010, IPC No. B81B7/00; B81C1/00, Patent No. GB 2476209B, Priority date 19 Sep 2008

Research output: Patent

High efficiency wideband aperture-coupled stacked patch antennas assembled using millimeter thick micromachined polymer structures

Pavuluri, S. K., Wang, C. & Sangster, A. J., Nov 2010, In : IEEE Transactions on Antennas and Propagation. 58, 11, p. 3616-3621 6 p., 5559354.

Research output: Contribution to journalArticle

Microstrip antennas
Antennas
Polymers
Substrates
Liquid crystal polymers

Near-eutectic Sn-Ag-Cu solder bumps formation for flip-chip interconnection by electrodeposition

Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 144-150 7 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition
Soldering alloys
Eutectics
Deposits
Scanning electron microscopy
2009

BCB-based wafer-level packaging of integrated CMOS/SOI piezoresistive MEMS sensors

Weiland, D., Chaehoi, A., Ray, S., O'Connell, D., Begbie, M. & Wang, C., 2009, 2009 European Microelectronics and Packaging Conference, EMPC 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Sensors
Accelerometers
Amplification

Characterization of a photosensitive dry adhesive film for wafer level MEMS packaging

Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 485-489 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Adhesives
Packaging
Polymers
Glass

Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Qin, Y., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 278-282 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

solders
electrodeposition
baths
eutectics
iodides

Electrodeposition of Sn-Cu solder alloy for electronics interconnection

Qin, Y., Wassay, A., Liu, C., Wilcox, G. D., Zhao, K. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 772-777 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrodeposition
Soldering alloys
Eutectics
Electronic equipment
Surface active agents

Growth and recrystallization of electroplated copper columns

Liu, J., Liu, C., Conway, P. P., Zeng, J. & Wang, C., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 695-700 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

copper
annealing
crystal structure
microstructure
grain size

Integrated sensors for health monitoring in advanced electronic systems

Wang, C. H., Liu, Y., Desmulliez, M. & Richardson, A., 2009, 2009 4th International Design and Test Workshop, IDT 2009.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Health
Monitoring
Sensors
Atmospheric humidity
Microsystems

Recent advances in laser assisted polymer intermediate layer bonding for MEMS packaging

Changhai, W., Jun, Z. & Yufei, L., 2009, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. p. 31-35 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
caps
polymers
lasers

Temperature monitoring in Laser assisted polymer bonding for MEMS packaging using a thin film sensor array

Liu, Y., Zeng, J. & Wang, C., 2009, SAS 2009 - IEEE Sensors Applications Symposium Proceedings. p. 52-55 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
sensors
polymers
thin films
2008

A high-performance aperture-coupled patch antenna supported by a micromachined polymer ring

Pavuluri, S. K., Wang, C. H. & Sangster, A. J., 2008, In : IEEE Antennas and Wireless Propagation Letters. 7, 2008, p. 283-286 4 p., 928468.

Research output: Contribution to journalArticle

Microstrip antennas
Microwaves
Polymers
Substrates
Polyimides

Chip scale studies of BCB based polymer bonding for MEMS packaging

Wang, C. H., Zeng, J., Zhao, K. & Chan, H. L., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1869-1873 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Packaging
Polymers
Substrates
Seals

Fabrication and assembly of high gain MEMS antennas for wireless communications

Wang, C. H. & Pavuluri, S. K., 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1941-1945 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Antennas
Fabrication
Communication
Polymers

Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 669-677 9 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

frit
illumination
laser beams
scanning
glass

Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J. & Hand, D. P., 2008, ICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings. p. 122-131 10 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

frit
illumination
laser beams
scanning
glass

In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging

Liu, Y., Zeng, J. & Wang, C., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 199-203 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Process control
Packaging
Lasers
Monitoring

Laser assisted polymer bonding technology for advanced MEMS packaging

Zeng, J. & Wang, C. H., 2008, Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. p. 1225-1229 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
microelectromechanical systems
polymers
lasers
beamforming

Localised laser joining of glass to silicon with BCB intermediate layer

Wu, Q., Kloss, S., Lorenz, N., Wang, C., Moore, A. J. & Hand, D. P., 2008, 3rd Pacific International Conference on Applications of Lasers and Optics, PICALO 2008 - Conference Proceedings. p. 859-863 5 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

glass
temperature sensitive paints
silicon
lasers
heating
2007

A cavity based high gain MEMS antenna for microwave and millimetre wave applications

Pavuluri, S. K., Wang, C. H. & Sangster, A. J., 2007, 2nd European Conference on Antennas and Propagation, EuCAP 2007. 11961 ed. Vol. 2007.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Millimeter waves
MEMS
Microstrip antennas
Microwaves
Antennas

A low cost bumping method for flip chip assembly and MEMS integration

Zhang, J., Wang, C., Zeng, J. & Pang, A. J., Dec 2007, In : IEEE Transactions on Components and Packaging Technologies. 30, 4, p. 781-786 6 p.

Research output: Contribution to journalArticle

MEMS
Costs
Gold
Nickel
Thermal cycling

Laser bonding of glass to silicon using polymer for microsystems packaging

Bardin, F., Kloss, S., Wang, C. H., Moore, A. J., Jourdain, A., De Wolf, I. & Hand, D. P., Jun 2007, In : Journal of Microelectromechanical Systems. 16, 3, p. 571-580 10 p.

Research output: Contribution to journalArticle

silicon polymers
packaging
cavities
glass
microelectromechanical systems

Theoretical and experimental studies of flip-chip assembled high-Q suspended MEMS inductors

Zeng, J., Wang, C. & Sangster, A. J., Jun 2007, In : IEEE Transactions on Microwave Theory and Techniques. 55, 6, p. 1171-1181 11 p.

Research output: Contribution to journalArticle

inductors
microelectromechanical systems
Q factors
chips
meanders
2006

Laser assisted system and method for bonding of surfaces, microcavity for packaging MEMS devices

Wang, C., Hand, D. P. & Bardin, F., 30 Nov 2006, IPC No. B23K 26/08 (2006.01), B81C 5/00 (2006.01), B23K 26/06 (2006.01), B23K 101/40 (2006.01), B81B 7/00 (2006.01), Patent No. PCT/GB2006/001971, Priority date 27 May 2005

Research output: Patent

packaging
adhesives
microelectromechanical systems
heat
lasers

Laser joining of glass to silicon using adhesive for MEMS packaging applications

Bardin, F., Kloss, S., Wang, C. H., Moore, A., Jourdain, A., De Wolf, I. & Hand, D. P., 2006, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 6107.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

packaging
adhesives
microelectromechanical systems
cavities
glass
2005

Flip chip assembled MEMS inductors

Zeng, J., Pang, A. J., Wang, C. H. & Sangster, A. J., 14 Apr 2005, In : Electronics Letters. 41, 8, p. 480-481 2 p.

Research output: Contribution to journalArticle

MEMS
Substrates
Inductance
Silicon
Air
2004

A low cost bumping method for flip chip assembly and MEMS integration

Zhang, J. H., Wang, C. H., Pang, A. J. & Zeng, J., 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04. p. 171-176 6 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MEMS
Costs
Gold
Nickel
Melting point