Network

Pierre M. Petroff

  • Fudan University
  • University of California Santa Barbara
  • University of Pavia

External person

Khaled Karrai

  • Ludwig Maximilian University of Munich

External person

Antonio Badolato

  • University of California Santa Barbara

External person

D Gershoni

  • Technion - Israel Institute of Technology

External person

Martin Kroner

  • Ludwig Maximilian University of Munich

External person

E Poem

  • Technion - Israel Institute of Technology

External person

Kenji Watanabe

  • National Institute for Materials Science

External person

Takashi Taniguchi

  • National Institute for Materials Science

External person

Jin Dong Song

  • Korea Institute of Science and Technology

External person

N. Akopian

  • Technion - Israel Institute of Technology

External person

Nick G. Stoltz

  • University of California Santa Barbara

External person

Juan F. Sánchez-Royo

  • University of Valencia

External person

Suk In Park

  • Korea Institute of Science and Technology

External person

Benjamin Biedermann

  • Ludwig Maximilian University of Munich

External person

A Imamoğlu

  • University of California Santa Barbara

External person

Valerio Vitale

  • Imperial College London

External person

Johannes Lischner

  • Imperial College London

External person

Edmund Clarke

  • University of Sheffield

External person

E. L. Hu

  • University of California Santa Barbara

External person

S. Remi

  • Ludwig Maximilian University of Munich

External person

Alexander W. Holleitner

  • Technical University of Munich

External person

Klaus D. Jöns

  • KTH Royal Institute of Technology

External person

Peter Lomax

  • University of Edinburgh

External person

Shuang Zhang

  • Hong Kong Baptist University
  • University of Birmingham
  • University of Hong Kong

External person

Sebastien Barbat

  • KTH Royal Institute of Technology

External person

Bernhard Urbaszek

  • University of Toulouse
  • Darmstadt University of Technology

External person

Alejandro Molina-Sánchez

  • University of Valencia
  • International Iberian Nanotechnology Laboratory

External person

Carlos Errando-Herranz

  • KTH Royal Institute of Technology

External person

Graham S. Wood

  • University of Edinburgh

External person

Art Branny

  • KTH Royal Institute of Technology

External person

Val Zwiller

  • KTH Royal Institute of Technology

External person

Ying Gu

  • Peking University
  • Peking University
  • Peking University

External person

Andrew Griffiths

  • University of Sheffield

External person

Rebecca Cheung

  • University of Edinburgh
  • Hong Kong Polytechnic University

External person

Samuel Gyger

  • KTH Royal Institute of Technology

External person

Wolfgang Knolle

  • Leibniz Institute of Surface Engineering

External person

S. Seidl

  • Ludwig Maximilian University of Munich

External person

Xiaofei Zang

  • University of Shanghai for Science and Technology
  • Tongji University

External person

Andreas V. Stier

  • Technical University of Munich

External person

Daniel Andres-Penares

  • University of Valencia

External person

Juan P. Martínez-Pastor

  • University of Valencia
  • Fundación Instituto de Inmunología

External person

Ursula Wurstbauer

  • University of Münster

External person

Qihuang Gong

  • Peking University

External person

Ulrika Wennberg

  • KTH Royal Institute of Technology

External person

C. Reese

  • University of California Santa Barbara

External person

Ali W. Elshaari

  • KTH Royal Institute of Technology

External person

Eva Schöll

  • KTH Royal Institute of Technology

External person

Jonathan J. Finley

  • Technical University of Munich

External person

Thibaut Renaud

  • KTH Royal Institute of Technology

External person

Dirk Bouwmeester

  • Leiden University
  • University of California Santa Barbara

External person

Mirco Troue

  • Technical University of Munich

External person

Paola Atkinson

  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden
  • Paris Institute of Nanosciences

External person

S. Minvielle

  • University of California Santa Barbara

External person

Luca Sortino

  • Ludwig Maximilian University of Munich

External person

Andreas Boes

  • Royal Melbourne Institute of Technology

External person

Zuoliang Yin

  • Qingdao University

External person

Evan J. Telford

  • Columbia University

External person

S. J. Cheng

  • National Chiao Tung University

External person

J. Huwer

  • Toshiba Research Europe Ltd

External person

Xavier Roy

  • Columbia University

External person

Zile Li

  • Wuhan University

External person

Jingtao Xin

  • Beijing Information Science and Technology University

External person

Roberto G. Pousa

  • University of Strathclyde

External person

Angelo C. Frangeskou

  • University of Warwick

External person

Nguyen Tien Son

  • Linköping University

External person

Y. Chye

  • University of California Santa Barbara

External person

Richard F. L. Evans

  • University of York

External person

Eugenio Zallo

  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

D. A. Ritchie

  • University of Cambridge

External person

D. D. Awschalom

  • University of California Santa Barbara

External person

Mark Blei

  • Arizona State University

External person

Ziwei Wang

  • University of Manchester

External person

Elton J. G. Santos

  • University of Edinburgh

External person

P. R. Dolan

  • University of Oxford

External person

S. Johnson

  • University of Oxford

External person

M. B. Ward

  • Toshiba Research Europe Ltd

External person

Jiaqiang Yan

  • Oak Ridge National Laboratory

External person

J. M. Smith

  • University of Oxford

External person

Alex McMillan

  • University of Bristol

External person

Kartik Srinivasan

  • National Institute of Standards and Technology

External person

Benjamin Lassagne

  • University of Toulouse

External person

Wenjie Zhang

  • China University of Petroleum (East China)

External person

Jensen Li

  • Hong Kong University of Science and Technology
  • University of Birmingham

External person

Jia-Yu Zhang

  • SouthEast University

External person

Guillermo Muñoz-Matutano

  • University of Valencia

External person

Xavier Marie

  • University of Toulouse

External person

Liuyan Zhao

  • University of Michigan

External person

Alfredo Segura

  • University of Valencia

External person

Oliver G. Schmidt

  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

A. A. P. Trichet

  • University of Oxford

External person

Faebian Bastiman

  • University of Sheffield

External person

Guoxing Zheng

  • Wuhan University
  • Georgia Institute of Technology

External person

Andrés Cantarero

  • University of Valencia

External person

Cedric Robert

  • University of Toulouse

External person

Luis Balicas

  • Florida State University

External person

C Becher

  • University of California Santa Barbara

External person

R. M. Stevenson

  • Toshiba Research Europe Ltd

External person

Mason Gray

  • Boston College

External person

Zurab Guguchia

  • University of Zurich

External person

Albert Fert

  • Paris-Saclay University

External person

Kenneth S. Burch

  • Boston College

External person

Jiarui Wu

  • Peking University

External person

Yiping Cui

  • SouthEast University

External person

Mairbek Chshiev

  • Grenoble Alpes University

External person

Kostya S. Novoselov

  • National University of Singapore

External person

Lukas Sigl

  • Technical University of Munich

External person

Thomas F. Krauss

  • University of St. Andrews

External person

Akram Boukai

  • University of California Los Angeles
  • California Institute of Technology

External person

Yong Ma

  • Chongqing University of Posts and Telecommunications

External person

Yiping Wang

  • Boston College

External person

Sefaattin Tongay

  • Arizona State University

External person

James R. Heath

  • University of California Los Angeles
  • California Institute of Technology

External person

Manuel Katzer

  • Technical University of Berlin

External person

Robert H. Hadfield

  • University of Glasgow

External person

Malte Selig

  • Technical University of Berlin

External person

Uri Vool

  • Harvard University

External person

E. M. Clarke

  • Imperial College London
  • University of Sheffield

External person

Artem Mishchenko

  • University of Manchester

External person

Yunyun Dai

  • Aalto University

External person

Assaf Hamo

  • Harvard University

External person

I. Farrer

  • University of Cambridge

External person

Mu Zhou

  • Chongqing University of Posts and Telecommunications

External person

Ming Gong

  • The Chinese University of Hong Kong

External person

Yue Wang

  • University of York

External person

J. S. Speck

  • University of California Santa Barbara

External person

M. Felle

  • University of Cambridge

External person

Sam Randerson

  • University of Sheffield

External person

Mikko Turunen

  • Aalto University

External person

Gerard Tobias

  • Institut de Ciència de Materials de Barcelona

External person

Jonathan H Prechtel

  • University of Basel

External person

Ming-Huei Chen

  • Boston University

External person

Andreas Knorr

  • Technical University of Berlin

External person

Matteo Barbone

  • Technical University of Munich

External person

Moritz Meyer

  • Technical University of Munich

External person

Jiacheng Wang

  • Nanyang Technological University

External person

Takeshi Ohshima

  • National Institutes for Quantum and Radiological Science and Technology
  • Tohoku University

External person

W. Zhang

  • Ohio University

External person

Dan Dalacu

  • National Research Council of Canada
  • University of Ottawa

External person

Patrick S. Salter

  • University of Oxford

External person

J. Skiba-Szymanska

  • Toshiba Research Europe Ltd

External person

Hyun Ho Kim

  • Kumoh National Institute of Technology

External person

Ted S. Santana

  • Federal University of ABC

External person

J. M. Garcia

  • Instituto de Microelectrónica de Madrid

External person

Riccardo Sapienza

  • Imperial College London

External person

Hongyi Chen

  • Peking University
  • Chinese Academy of Sciences

External person

Panaiot G. Zotev

  • University of Sheffield

External person

M. Zahid Hasan

  • Oak Ridge National Laboratory
  • Florida State University
  • Princeton University

External person

Malte Kremser

  • Technical University of Munich

External person

A. J. Shields

  • Toshiba Research Europe Ltd
  • Toshiba Corporation

External person

Mathias Augustin

  • University of Edinburgh

External person

Maciej Koperski

  • National University of Singapore

External person

Zhipei Sun

  • University of Cambridge
  • Aalto University

External person

Alberto Peruzzo

  • Royal Melbourne Institute of Technology
  • University of Bristol

External person

P. Soubelet

  • Technical University of Munich

External person

John G. Rarity

  • University of Bristol

External person

Fei Ding

  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

Gavin W. Morley

  • University of Warwick

External person

Zhongyin Hu

  • Chongqing University of Posts and Telecommunications

External person

K. G. Subramanian

  • Universiti Sains Malaysia
  • University of California Santa Barbara

External person

Dongxing Zhao

  • Peking University
  • Aston University

External person

Alexey Falin

  • Deakin University

External person

Iann C. Gerber

  • University of Toulouse

External person

Luojia Wang

  • Peking University

External person

Xingrui Cheng

  • University of Oxford

External person

D. Pine

  • University of California Santa Barbara

External person

Joerg Wrachtrup

  • University of Stuttgart

External person

Lu Hua Li

  • Deakin University

External person

Florian Sigger

  • Technical University of Munich

External person

Frederic Diana

  • University of California Santa Barbara

External person

Rui He

  • Texas Tech University

External person

Josep Canet-Ferrer

  • University of Valencia

External person

Robert J. Chapman

  • Royal Melbourne Institute of Technology
  • ETH Zurich

External person

Qi-Chao Sun

  • University of Stuttgart

External person

J. A. Johnson

  • University of California Santa Barbara

External person

Daniel K. L. Oi

  • University of Strathclyde

External person

Huigang Liu

  • Nankai University

External person

H. Lee

  • University of California Santa Barbara

External person

Charalambos Louca

  • University of Sheffield

External person

Sarah Jenkins

  • University of Duisburg-Essen

External person

Amir Yacoby

  • Harvard University

External person

Y. H. Liao

  • National Chiao Tung University

External person

Lorenzo Vinco

  • Polytechnic University of Milan

External person

Alexander I. Tartakovskii

  • University of Sheffield

External person

Yu Liu

  • Shandong University

External person

Janine Gückelhorn

  • Technical University of Munich

External person

Gang Wang

  • University of Edinburgh

External person

Nicholas A. Melosh

  • University of California Los Angeles
  • California Institute of Technology

External person

E. Johnston-Halperin

  • University of California Santa Barbara

External person

Amilcar Bedoya-Pinto

  • Max Planck Institute of Microstructure Physics
  • University of Valencia

External person

Cory R. Dean

  • Columbia University

External person

Avalon H. Dismukes

  • Columbia University

External person

Jonas Kiemle

  • Technical University of Munich

External person

Rafael Mata

  • University of Valencia

External person

John Jeffers

  • University of Strathclyde

External person

M. E. White

  • University of California Santa Barbara

External person

Adam W. Tsen

  • University of Waterloo

External person

Tahiyat Huq

  • Imperial College London

External person

Yadong Wang

  • Aalto University

External person

G. Bester

  • Max Planck Institute for Solid State Research

External person

Jawad Ul Hassan

  • Linköping University

External person

Junxiang Zhang

  • Shanxi University

External person

Toby Severs‐Millard

  • University of Sheffield

External person

Pengcheng Dai

  • Rice University

External person

Kai Müller

  • Technical University of Munich

External person

Stuart Parkin

  • Max Planck Institute of Microstructure Physics

External person

Kenneth S. Burch

  • Boston College

External person

Cedomir Petrovic

  • Brookhaven National Laboratory

External person

Will Mccutcheon

  • University of Bristol

External person

Armando Rastelli

  • Johannes Kepler University Linz
  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

Dario Polli

  • Polytechnic University of Milan
  • Istituto di Fotonica e Nanotecnologie

External person

Johannes D. Plumhof

  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

Philip J. Poole

  • National Research Council of Canada

External person

Giulio Cerullo

  • Polytechnic University of Milan
  • Istituto di Fotonica e Nanotecnologie

External person

Enric Canadell

  • Institut de Ciència de Materials de Barcelona

External person

Johannes Knörzer

  • Max-Planck-Institute for Quantum Optics

External person

W. V. Schoenfeld

  • University of California Santa Barbara

External person

Hiroshi Abe

  • National Institutes for Quantum and Radiological Science and Technology

External person

Ruth Oulton

  • University of Bristol

External person

Jia-Xin Yin

  • Princeton University

External person

Rinaldo Trotta

  • Johannes Kepler University Linz
  • Leibniz-Institut für Festkörper- und Werkstoffforschung Dresden

External person

B. Gayral

  • University of California Santa Barbara

External person

Xuerong Hu

  • University of Sheffield

External person

Tiancai Zhang

  • Shanxi University

External person

Qing Hua Wang

  • Arizona State University

External person