Megasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects

Press/Media: Research

Description

For more than four years, Merlin Circuit Technology Ltd (MCT), in Deeside, North Wales, has been working in collaboration with Heriot-Watt University (HWU) in Edinburgh, Scotland, on a UK government project funded by the Engineering and Physical Sciences Research Council (EPSRC), looking to improve HD PCB manufacturing capability through enhancements to the electrodeposition of copper using high frequency acoustic, applied within a copper plating bath. This article outlines some of the key findings from this project.

Period1 Jun 2017

Media contributions

1

Media contributions

  • TitleMegasonic Acoustic Surface Treatment Process for Enhanced Copper Electrodeposition in Via Interconnects
    Degree of recognitionInternational
    Media name/outletThe PCB magazine
    Media typeWeb
    Duration/Length/Size7 pages
    CountryUnited Kingdom
    Date1/06/17
    DescriptionFor more than four years, Merlin Circuit Technology Ltd (MCT), in Deeside, North Wales, has been working in collaboration with
    Heriot-Watt University (HWU) in Edinburgh, Scotland, on a UK government project funded by the Engineering and Physical Sciences Research Council (EPSRC), looking to improve HD PCB manufacturing capability through enhancements to the electrodeposition of copper using high frequency acoustic, applied within a copper plating bath. This article outlines some of the key findings from this project.
    Producer/AuthorThomas Jones
    URLiconnect007.uberflip.com/i/834021-pcb-jun2017
    PersonsDavid Flynn, Marc Phillipe Yves Desmulliez, Thomas Jones, Dennis Price

Keywords

  • PCB
  • Megasonic
  • Electrodeposition
  • High Density
  • interconnects